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English(EN) China can make advanced chips without EUV, but the bill keeps growing

中国利用DUV光刻技术推进芯片制造，面临成本上升和良率下降的挑战

作者 PulseAugur 编辑部 · [1 个来源] ·

尽管受到获取先进极紫外光刻（EUV）设备的限制，中国正通过利用深紫外光刻（DUV）技术结合多重曝光技术来推进其国内芯片制造能力。这种方法使得生产复杂芯片成为可能，正如华为Mate 60 Pro所展示的那样，但这伴随着显著的权衡。该工艺涉及更复杂的制造步骤，导致芯片尺寸更大、良率更低，并且与EUV光刻相比，生产成本更高。 AI

影响 凸显了先进半导体制造领域的持续全球竞争，这对人工智能硬件发展至关重要。

排序理由 文章讨论了一项重大的技术进步及其对半导体行业主要全球参与者的经济影响。 [lever_c_demoted from significant: ic=1 ai=0.7]

在 Tom's Hardware 阅读 →

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中国利用DUV光刻技术推进芯片制造，面临成本上升和良率下降的挑战

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文章讨论了一项重大的技术进步及其对半导体行业主要全球参与者的经济影响。 [lever_c_demoted from significant: ic=1 ai=0.7]
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报道来源 [1]

  1. Tom's Hardware TIER_1 English(EN) · Chris Stokel-Walker ·

    China can make advanced chips without EUV, but the bill keeps growing

    China has stretched older DUV lithography far further than expected, using multiple patterning to approach 5nm-class without EUV. But experts say the trade-offs in cost, yield, and die size mean further advancements are unlikely to be economically viable.

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