English(EN) Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck

Intel申请XBM内存架构专利，旨在降低AI的HBM成本

作者 PulseAugur 编辑部 · [1 个来源] · 2026-07-07 10:00

英特尔（Intel）已申请一项名为XBM的新内存架构专利，旨在克服当前高带宽内存（HBM）技术的局限性和高昂成本。这种新颖的方法通过消除昂贵的硅中介层的需求，转而利用后端晶体管DRAM堆栈和串行UCIe链路来降低成本。该设计还集成了内置修复机制，以提高良率并解决AI硬件日益增长的内存瓶颈问题。 AI

影响这种新的内存架构可以显著降低AI加速器高性能内存的成本，可能加速其采用和发展。

排序理由一项关于新型内存架构的专利申请。[lever_c_demoted from research: ic=1 ai=0.7]

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Tom's Hardware TIER_1 English(EN) · Etiido Uko · 2026-07-07 10:00

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck

Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.

报道来源 [1]

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck

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