PulseAugur
中
实时 18:54:54
English(EN) Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'

Intel聘请SK海力士前CEO领导先进封装部门

作者 PulseAugur 编辑部 · [1 个来源] ·

Intel已任命SK海力士前首席执行官李锡熙领导其Intel Foundry部门下的先进封装业务。此举标志着Intel决定将先进封装作为一项独立的业务单元，专注于将高带宽内存（HBM）等组件与逻辑芯片集成，以用于AI加速器。尽管其代工业务近期出现财务亏损，但该公司旨在通过改进其EMIB封装技术来与台积电（TSMC）等成熟的竞争对手展开竞争。 AI

影响 Intel的这一战略举措旨在巩固其在先进封装领域的地位，这是AI加速器的关键组成部分，可能会影响AI硬件的供应链。

排序理由 从竞争对手高调聘请高管来领导新成立的关键业务部门。[lever_c_demoted from significant: ic=1 ai=0.7]

在 Tom's Hardware 阅读 →

AI 生成摘要 · Google Gemini · 来自 1 个来源。 我们如何撰写摘要 →

Intel聘请SK海力士前CEO领导先进封装部门

报道来源 [1]

  1. Tom's Hardware TIER_1 English(EN) · Luke James ·

    Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership'

    Intel has appointed Seok-Hee Lee, the former chief executive of memory maker SK hynix and battery maker SK On, as executive vice president of Intel Foundry.

相关实体

相关话题