据报道，谷歌已向英特尔下达订单，将在2028年生产超过300万个张量处理单元（TPU）。此举正值台积电的先进封装解决方案，特别是CoWoS，在2027年底前已严重超额预订，导致AI芯片生产出现瓶颈。SK海力士正在测试英特尔的EMIB封装以集成HBM，这被视为近期大规模AI芯片制造的唯一可行替代方案。 AI
影响 为谷歌确保了关键的AI芯片制造产能，可能缓解供应链瓶颈，并验证了英特尔的先进封装解决方案。
排序理由 AI硬件制造产能的重大订单，凸显了供应链限制和新供应商的出现。
AI 生成摘要 · Google Gemini · 来自 4 个来源。 我们如何撰写摘要 →
Google has placed an order for Intel to build more than 3 million of its TPUs in 2028 after months of testing Intel's advanced packaging.
Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration Google has placed an order for Intel to build more than 3 million of its TPUs in 2028 after months of testing Intel's advanced packaging. …
🎮 Google reportedly orders at least three million chips from Intel to arrive in 2028, as TSMC struggles to keep up with the AI boom Could Intel's Foundry efforts be starting to pay off? 📰 Source: Latest from PC Gamer 🔗 Link: https://www.pcgamer.com/hardware/google-reportedly-orde…
RT @rohanpaul_ai: TRANSLASION: Der Information berichtet, dass Google Intel ausgewählt hat, um über 3 Millionen Google-TPUs im Jahr 2028 herzustellen. mehr auf Arint.info # AI # Foundry # Google # Intel # Semiconductor # TPU # arint_info https://x.com/rohanpaul_ai/status/20639878…