English(EN) Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners

Intel出货首批使用ASML高数值孔径EUV光刻技术制造的芯片

作者 PulseAugur 编辑部 · [1 个来源] · 2026-07-15 15:33

Intel已成为首家将ASML的高数值孔径EUV光刻技术用于大规模芯片生产的公司。这一里程碑涉及在其即将推出的Panther Lake处理器（基于Intel 18A工艺节点）的选定层中使用这项先进技术。这些通过双重认证的层既可以在现有EUV扫描仪上处理，也可以在新一代高数值孔径EUV扫描仪上处理，标志着半导体制造从研发走向商业部署的重要一步。 AI

影响半导体光刻技术的这一进步使得芯片图案更加密集和精确，这对于满足人工智能工作负载日益增长的需求至关重要。

排序理由首家出货使用ASML高数值孔径EUV光刻技术制造的芯片的公司。[lever_c_demoted from significant: ic=1 ai=0.7]

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报道来源 [1]

Tom's Hardware TIER_1 English(EN) · Etiido Uko · 2026-07-15 15:33

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners

Intel is using ASML’s High-NA EUV tools to pattern select Panther Lake layers, marking the technology’s first use in high-volume logic production

报道来源 [1]

Intel becomes the first company to ship high-volume logic chips made with ASML's High NA EUV — select Panther Lake layers on 18A are now dual-qualified for 0.55 NA scanners

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