Cowos
PulseAugur coverage of Cowos — every cluster mentioning Cowos across labs, papers, and developer communities, ranked by signal.
- 2026-07-10 product_launch TSMC is significantly increasing its advanced packaging capacity for CoWoS technology. source
3 day(s) with sentiment data
-
3D AI Chips: Diverse Architectures, Unified Goal of Enhanced Performance
The AI chip market is experiencing a surge in interest for 3D stacking technologies, driven by the increasing demands of AI agents for greater memory capacity, bandwidth, and data efficiency. While companies are adoptin…
-
TSMC expands AI chip packaging capacity amid surging demand · 1 source tracked
TSMC is facing a shortage in CoWoS packaging capacity due to high demand for AI chips, particularly from NVIDIA. To address this, TSMC plans to outsource more CoWoS production to other manufacturers like ASE Technology …
-
Google reportedly taps Intel's EMIB-T for next-gen TPUs, challenging TSMC's packaging dominance
Google is reportedly shifting its next-generation Tensor Processing Unit (TPU) production, codenamed Humufish, from TSMC's CoWoS-L advanced packaging to Intel's EMIB-T technology. This move, if accurate, signifies a sig…
-
Volkswagen eyes massive job cuts, Samsung develops AI chip, TSMC expands capacity · 1 source tracked
Several major companies are making significant moves across different sectors. Volkswagen is considering a substantial workforce reduction, potentially impacting up to 120,000 jobs globally, which has led to protests fr…
-
LingSi Technology raises 500M yuan for AI chips; TSMC expands advanced packaging capacity
LingSi Technology, a company specializing in edge AI inference chips, has secured nearly 500 million yuan in Series B funding. The round was led by state-owned investment platforms from Anhui Province and Hefei City, wi…
-
TSMC accelerates CoWoS advanced packaging expansion to meet demand
TSMC is significantly increasing its advanced packaging capacity, specifically for its CoWoS technology, to meet soaring demand. The company aims for a monthly CoWoS production capacity of at least 200,000 wafers by 202…
-
JEDEC's SPHBM4 Standard Slashes AI Memory Costs
JEDEC has introduced a new standard, SPHBM4, designed to reduce the cost of High Bandwidth Memory (HBM) used in AI processors. This standard utilizes a narrower 512-bit interface and allows for the use of less expensive…
-
New SPHBM4 standard aims to democratize HBM for AI chips
JEDEC has announced a new standard, SPHBM4 (JESD330-4), designed to democratize High Bandwidth Memory (HBM) by enabling its use in standard packaging. This new standard allows for HBM assembly outside of specialized, su…
-
Google's Humufish TPU to use Intel EMIB-T over TSMC CoWoS
Google's upcoming TPU, codenamed Humufish, will reportedly utilize Intel's EMIB-T packaging technology instead of the industry-standard TSMC CoWoS. This move is significant as most current AI training accelerators rely …
-
TSMC boosts advanced chip capacity by 70% to meet AI demand
TSMC is significantly increasing its advanced manufacturing capacity, with plans for N2/A16 processes to grow at a 70% compound annual rate between 2026 and 2028. This expansion is driven by the surge in AI and high-per…
-
Insilico Medicine and SK Biopharmaceuticals ink $2.5B AI drug discovery deal
Insilico Medicine and SK Biopharmaceuticals have entered into a significant research collaboration valued at over $2.5 billion. The partnership will leverage Insilico's AI-driven Pharma.AI platform to discover novel dru…
-
Ashi Chuang denies supplying TSMC with semiconductor sputtering targets
Ashi Chuang has denied market rumors suggesting they supply semiconductor sputtering targets to TSMC for CoWoS packaging materials. The company stated on an interactive platform that these rumors are untrue. Separately,…
-
Intel taps ex-SK Hynix chief to lead new advanced packaging unit
Intel has appointed Seok-Hee Lee, former CEO of SK hynix, to lead its advanced packaging division within Intel Foundry. This move signifies Intel's strategic decision to establish advanced packaging as a distinct busine…
-
Anthropic establishes Seoul office as part of global expansion
Anthropic has announced its expansion into South Korea with the establishment of a new office in Seoul. This move is part of the company's broader global strategy. The news also touches upon unrelated market development…
-
Glass substrate tech gains market focus amid company R&D updates; Biogen eyes RayThera acquisition
The market is showing increased interest in glass substrate technology, spurred by TSMC's development plan. Several companies, including XingSen Technology, Medi-Tech, Vogue Optoelectronics, and Qibin Group, have announ…
-
TSMC prioritizes CoWoS for AI chips amid packaging slowdown
TSMC is reportedly slowing down its panel packaging development, a technology that could be crucial for future AI chip manufacturing. The company is expected to continue relying on its CoWoS (Chip-on-Wafer-on-Substrate)…
-
TSMC: Panel Packaging Won't Replace CoWoS for Large AI Chips Soon
TSMC's senior vice president Kevin Zhang stated that panel-level packaging technologies will not replace their current wafer-level packaging solutions like CoWoS in the near future for large AI processors. While panel p…
-
Hongban Tech verifies 1.6T optical module PCBs; TSMC explores glass substrates for CoWoS
Hongban Technology has successfully completed technical verification for its PCB products related to 800G and 1.6T optical modules, with downstream clients including several leading companies in the industry. The compan…
-
TSMC advances glass substrate tech for CoWoS packaging
TSMC has initiated a development plan for glass substrates within its CoWoS advanced packaging technology, collaborating with Ibiden and Innolux to assess feasibility. This marks TSMC's first public disclosure of its gl…
-
TSMC accelerates AI chip production with massive fab expansion
TSMC is undertaking its most aggressive manufacturing expansion to date, aiming to meet surging demand for AI processors and advanced chips. The company is doubling its historical construction pace, building new fabs ac…