Cowos
PulseAugur coverage of Cowos — every cluster mentioning Cowos across labs, papers, and developer communities, ranked by signal.
10 day(s) with sentiment data
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TSMC boosts advanced chip capacity by 70% to meet AI demand
TSMC is significantly increasing its advanced manufacturing capacity, with plans for N2/A16 processes to grow at a 70% compound annual rate between 2026 and 2028. This expansion is driven by the surge in AI and high-per…
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Insilico Medicine and SK Biopharmaceuticals ink $2.5B AI drug discovery deal
Insilico Medicine and SK Biopharmaceuticals have entered into a significant research collaboration valued at over $2.5 billion. The partnership will leverage Insilico's AI-driven Pharma.AI platform to discover novel dru…
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Ashi Chuang denies supplying TSMC with semiconductor sputtering targets
Ashi Chuang has denied market rumors suggesting they supply semiconductor sputtering targets to TSMC for CoWoS packaging materials. The company stated on an interactive platform that these rumors are untrue. Separately,…
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Intel taps ex-SK Hynix chief to lead new advanced packaging unit
Intel has appointed Seok-Hee Lee, former CEO of SK hynix, to lead its advanced packaging division within Intel Foundry. This move signifies Intel's strategic decision to establish advanced packaging as a distinct busine…
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Anthropic establishes Seoul office as part of global expansion
Anthropic has announced its expansion into South Korea with the establishment of a new office in Seoul. This move is part of the company's broader global strategy. The news also touches upon unrelated market development…
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Glass substrate tech gains market focus amid company R&D updates; Biogen eyes RayThera acquisition
The market is showing increased interest in glass substrate technology, spurred by TSMC's development plan. Several companies, including XingSen Technology, Medi-Tech, Vogue Optoelectronics, and Qibin Group, have announ…
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TSMC prioritizes CoWoS for AI chips amid packaging slowdown
TSMC is reportedly slowing down its panel packaging development, a technology that could be crucial for future AI chip manufacturing. The company is expected to continue relying on its CoWoS (Chip-on-Wafer-on-Substrate)…
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TSMC: Panel Packaging Won't Replace CoWoS for Large AI Chips Soon
TSMC's senior vice president Kevin Zhang stated that panel-level packaging technologies will not replace their current wafer-level packaging solutions like CoWoS in the near future for large AI processors. While panel p…
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Hongban Tech verifies 1.6T optical module PCBs; TSMC explores glass substrates for CoWoS
Hongban Technology has successfully completed technical verification for its PCB products related to 800G and 1.6T optical modules, with downstream clients including several leading companies in the industry. The compan…
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TSMC advances glass substrate tech for CoWoS packaging
TSMC has initiated a development plan for glass substrates within its CoWoS advanced packaging technology, collaborating with Ibiden and Innolux to assess feasibility. This marks TSMC's first public disclosure of its gl…
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TSMC accelerates AI chip production with massive fab expansion
TSMC is undertaking its most aggressive manufacturing expansion to date, aiming to meet surging demand for AI processors and advanced chips. The company is doubling its historical construction pace, building new fabs ac…
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Google taps Intel for 3M+ TPUs in 2028 amid TSMC packaging crunch
Google has reportedly placed an order with Intel for over three million Tensor Processing Units (TPUs) to be manufactured in 2028. This move comes as TSMC's advanced packaging solutions, particularly CoWoS, are heavily …
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TSMC targets 2-3 years for CoPoS advanced packaging scale
TSMC Chairman C.C. Wei stated that the company's CoPoS advanced packaging technology is expected to reach significant production volumes within two to three years. This advancement follows their current CoWoS technology…
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OLED Material Demand Forecast Slashed Amidst Tech Shifts
Market research firm UBI Research has lowered its global OLED emissive material procurement forecast for this year to $2.54 billion, a 12.8% decrease from its previous prediction. This downward revision is attributed to…
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MediaTek to exclusively use Intel's advanced chip packaging for next-gen products
MediaTek has announced that its next-generation chips will exclusively utilize Intel's EMIB-T advanced packaging technology, moving away from TSMC's CoWoS solution. The company aims for a tape-out of this new chip in Q4…
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AI hardware bottleneck shifts to memory, consuming most advanced wafers
SemiAnalysis reports that the bottleneck in AI hardware is shifting from advanced packaging like CoWoS to memory, as wafer supply struggles to meet demand. This trend is projected to significantly increase AI's consumpt…
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AI chip memory costs surge to two-thirds of component spend
A recent analysis indicates that memory components, particularly High Bandwidth Memory (HBM), now constitute nearly two-thirds of the total cost for AI chips. This share has significantly increased from 52% to 63% betwe…
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Chip packagers shift to advanced tech, leaving legacy to China
Semiconductor packaging companies like ASE and Amkor are shifting from low-margin, commoditized assembly to high-margin advanced packaging crucial for AI and HPC applications. This strategic move involves significant in…
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Intel, SK Hynix shares jump on advanced chip packaging partnership rumors
Intel and SK hynix experienced significant stock price increases following reports of a potential chip packaging partnership. SK Hynix is reportedly testing Intel's 2.5D EMIB technology for integrating high-bandwidth me…
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TSMC plans 2029 AI chips with 48x compute, 34x memory bandwidth
TSMC has outlined its next-generation Chip-on-Wafer-on-Substrate (CoWoS) packaging roadmap, projecting a significant leap in AI processor capabilities by 2029. The company anticipates enabling up to 48 times more comput…