Cowos
PulseAugur coverage of Cowos — every cluster mentioning Cowos across labs, papers, and developer communities, ranked by signal.
- partners with GlobalFoundries 90%
- used by EMIB-T 90%
- used by Embedded multi-die interconnect bridge having a molded region with through-mold vias 90%
- competes with EMIB-T 70%
- used by GlobalFoundries 70%
- uses Tsmc Soic 70%
- competes with Embedded multi-die interconnect bridge having a molded region with through-mold vias 70%
- competes with Embedded Multi Die Interconnect Bridge 70%
- partners with EMIB-T 70%
- partners with Embedded Multi Die Interconnect Bridge 50%
- used by Embedded Multi Die Interconnect Bridge 50%
- 2026-07-10 product_launch TSMC is significantly increasing its advanced packaging capacity for CoWoS technology. source
4 day(s) with sentiment data
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AI Chip Design Shifts to Chiplets, Leveraging Advanced Packaging
The semiconductor industry is shifting from monolithic chip designs to a "chiplet" approach, breaking down complex processors into smaller, specialized components. This strategy allows each component to be manufactured …
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Qualcomm validates stacked AI memory architecture for 2027 accelerators
Qualcomm has successfully validated its High Bandwidth Compute (HBC) memory architecture, a key component for its upcoming Dragonfly AI250 data center accelerators. This stacked memory design places DRAM directly on top…
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TSMC eyes 20% CoWoS price hike amid AI chip demand surge · 1 source tracked
TSMC is reportedly considering a 20% price increase for its advanced CoWoS packaging technology due to surging demand for AI chips and extended equipment lead times. This increase is driven by the complex packaging requ…
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TSMC partners with GlobalFoundries for $2B interposer deal to ease AI chip bottleneck
TSMC is partnering with GlobalFoundries in a $2 billion deal to secure silicon interposers, aiming to alleviate its CoWoS packaging bottleneck. This collaboration, with production slated for 2028 in New York, highlights…
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GlobalFoundries partners with TSMC for AI chip components, Apple preps new home hub
GlobalFoundries has entered into a five-year, $2 billion agreement to produce silicon interposers for TSMC's CoWoS advanced packaging technology in the United States. This partnership will enable GlobalFoundries to cont…
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TSMC and GlobalFoundries ink $2B US silicon interposer deal
GlobalFoundries and TSMC have signed a five-year, $2 billion agreement for GlobalFoundries to produce silicon interposers in the US. These interposers are crucial for advanced packaging technologies like TSMC's CoWoS, e…
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TSMC's AI chip packaging bottleneck creates opening for Intel
TSMC's CoWoS packaging technology, crucial for integrating AI accelerators with High Bandwidth Memory, is facing significant cost and yield challenges due to the immense size of silicon interposers. These limitations ar…
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LG enters chip packaging tools market with new laser direct imaging machine
LG Electronics Production Technology Institute (PRI) is entering the chip packaging tools market with a new maskless laser direct imaging (LDI) lithography machine. This system is designed to create fine metal interconn…
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3D AI Chips: Diverse Architectures, Unified Goal of Enhanced Performance
The AI chip market is experiencing a surge in interest for 3D stacking technologies, driven by the increasing demands of AI agents for greater memory capacity, bandwidth, and data efficiency. While companies are adoptin…
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TSMC expands AI chip packaging capacity amid surging demand · 1 source tracked
TSMC is facing a shortage in CoWoS packaging capacity due to high demand for AI chips, particularly from NVIDIA. To address this, TSMC plans to outsource more CoWoS production to other manufacturers like ASE Technology …
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Google reportedly taps Intel's EMIB-T for next-gen TPUs, challenging TSMC's packaging dominance
Google is reportedly shifting its next-generation Tensor Processing Unit (TPU) production, codenamed Humufish, from TSMC's CoWoS-L advanced packaging to Intel's EMIB-T technology. This move, if accurate, signifies a sig…
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Volkswagen eyes massive job cuts, Samsung develops AI chip, TSMC expands capacity · 1 source tracked
Several major companies are making significant moves across different sectors. Volkswagen is considering a substantial workforce reduction, potentially impacting up to 120,000 jobs globally, which has led to protests fr…
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LingSi Technology raises 500M yuan for AI chips; TSMC expands advanced packaging capacity
LingSi Technology, a company specializing in edge AI inference chips, has secured nearly 500 million yuan in Series B funding. The round was led by state-owned investment platforms from Anhui Province and Hefei City, wi…
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TSMC accelerates CoWoS advanced packaging expansion to meet demand
TSMC is significantly increasing its advanced packaging capacity, specifically for its CoWoS technology, to meet soaring demand. The company aims for a monthly CoWoS production capacity of at least 200,000 wafers by 202…
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JEDEC's SPHBM4 Standard Slashes AI Memory Costs
JEDEC has introduced a new standard, SPHBM4, designed to reduce the cost of High Bandwidth Memory (HBM) used in AI processors. This standard utilizes a narrower 512-bit interface and allows for the use of less expensive…
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New SPHBM4 standard aims to democratize HBM for AI chips
JEDEC has announced a new standard, SPHBM4 (JESD330-4), designed to democratize High Bandwidth Memory (HBM) by enabling its use in standard packaging. This new standard allows for HBM assembly outside of specialized, su…
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Google's Humufish TPU to use Intel EMIB-T over TSMC CoWoS
Google's upcoming TPU, codenamed Humufish, will reportedly utilize Intel's EMIB-T packaging technology instead of the industry-standard TSMC CoWoS. This move is significant as most current AI training accelerators rely …
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TSMC boosts advanced chip capacity by 70% to meet AI demand
TSMC is significantly increasing its advanced manufacturing capacity, with plans for N2/A16 processes to grow at a 70% compound annual rate between 2026 and 2028. This expansion is driven by the surge in AI and high-per…
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Insilico Medicine and SK Biopharmaceuticals ink $2.5B AI drug discovery deal
Insilico Medicine and SK Biopharmaceuticals have entered into a significant research collaboration valued at over $2.5 billion. The partnership will leverage Insilico's AI-driven Pharma.AI platform to discover novel dru…
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Ashi Chuang denies supplying TSMC with semiconductor sputtering targets
Ashi Chuang has denied market rumors suggesting they supply semiconductor sputtering targets to TSMC for CoWoS packaging materials. The company stated on an interactive platform that these rumors are untrue. Separately,…