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中文(ZH) 消息称台积电CoWoS 2027年月产能目标至少20万片

TSMC accelerates CoWoS advanced packaging expansion to meet demand

By PulseAugur Editorial · [1 sources] ·

TSMC is significantly increasing its advanced packaging capacity, specifically for its CoWoS technology, to meet soaring demand. The company aims for a monthly CoWoS production capacity of at least 200,000 wafers by 2027, with projections suggesting it could reach 240,000-260,000 wafers by the end of that year. This aggressive expansion involves 24-hour construction schedules at new facilities, though the final allocation of equipment orders remains pending, causing some uncertainty among suppliers. AI

IMPACT Increased advanced packaging capacity is crucial for supporting the production of AI accelerators and high-performance computing chips.

RANK_REASON The article details a significant expansion of advanced packaging capacity by a major semiconductor manufacturer. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

TSMC accelerates CoWoS advanced packaging expansion to meet demand

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The article details a significant expansion of advanced packaging capacity by a major semiconductor manufacturer. [lever_c_demoted from significant: ic=1 ai=0.7]
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    TSMC's CoWoS monthly capacity target at least 200,000 pieces by 2027, according to reports

    据台湾电子时报，先进封装产能持续供不应求，台积电加速扩产。供应链指出，台积电所有新厂工程几乎都是24小时轮班施工，加速建设进度。设备厂商表示，据台积电释放出的信息来看，CoWoS月产能2024年约3万多片，2025年达7万片，2026年底原订11万片，但最终突破13万片，2027年扩产目标约20万片，但应为低标。市场乐观看待2027年底CoWoS月产能有望拉升至24万~26万片。不过，台积电至今仍未确立设备商的订单分配，导致供应链如坐针毡，担心形成降价抢单氛围，此外设备下单至生产出货时程至少7~9个月，供应商担心无法如期交付设备。（财联社）

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