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中文(ZH) 台积电计划2026年至2028年N2/A16先进工艺产能年复合增速达70%

TSMC boosts advanced chip capacity by 70% to meet AI demand

By PulseAugur Editorial · [1 sources] ·

TSMC is significantly increasing its advanced manufacturing capacity, with plans for N2/A16 processes to grow at a 70% compound annual rate between 2026 and 2028. This expansion is driven by the surge in AI and high-performance computing, which TSMC anticipates will constitute 55% of the global semiconductor market by 2030. The company also projects substantial growth in N3 and N5 processes and advanced packaging solutions like CoWoS and SoIC to meet this demand. AI

IMPACT TSMC's capacity expansion signals a major investment in the infrastructure required to support the continued growth of AI and high-performance computing workloads.

RANK_REASON TSMC, a major semiconductor manufacturer, announced significant capacity expansion plans for its advanced manufacturing processes. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

TSMC boosts advanced chip capacity by 70% to meet AI demand

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TSMC, a major semiconductor manufacturer, announced significant capacity expansion plans for its advanced manufacturing processes. [lever_c_demoted from significant: ic=1 ai=0.7]
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Only one publisher covered this so far. Single-source stories can still rank when the publisher is high-authority, but they lack cross-source corroboration.
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infra, product
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92 days old
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    TSMC plans to achieve a compound annual growth rate of 70% for N2/A16 advanced process capacity from 2026 to 2028

    台积电6月25日在上海国际会议中心举办“2026年中国技术论坛”（闭门会），向客户和合作伙伴分享其最新技术研发进展与行业洞察。面对AI爆发式增长，台积电预计，全球半导体市场将在今年突破1万亿美元，并在2030年达到1.5万亿美元。需求主要来自高性能计算（HPC）和AI领域，占整体市场的55%；其次，智能手机需求约占20%，汽车与物联网需求则各占约10%。台积电计划，2026年至2028年N2/A16先进工艺产能年复合增速达70%；2022年至2027年，N3、N5成熟先进制程产能年增长25%；N2首年晶圆产出量较N3同期高出45%。台积电计划，CoWoS…

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