English(EN) Peking University unveils 3D design tool to power Huawei’s chip ambitions

北京大学推出面向华为的3D芯片设计工具

作者 PulseAugur 编辑部 · [3 个来源] · 2026-05-27 14:00

北京大学已开发出一种原型3D电子设计自动化（EDA）工具，旨在支持华为的LogicFolding芯片架构。这款新软件旨在通过支持在国内设计先进半导体来帮助华为克服美国的贸易限制。据报道，该工具可将内部布线长度减少30%，并提高性能和热管理，但其生产就绪性尚待确定。 AI

影响这一发展可能减少对西方EDA工具的依赖，从而加速中国国内的芯片设计能力。

排序理由大学研究开发了一种具有潜在行业影响的新型EDA工具。

AI 生成摘要 · Google Gemini · 来自 3 个来源。我们如何撰写摘要 →

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Newsworthiness bucket: Research; 大学研究开发了一种具有潜在行业影响的新型EDA工具。
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SCMP — Tech TIER_1 English(EN) · Iris Deng · 2026-05-27 14:00

北京大学推出3D设计工具，助力华为芯片雄心

Researchers at Peking University have claimed a breakthrough in microchip design software, purportedly offering critical support to Huawei Technologies as the tech giant attempts to build cutting-edge semiconductors despite US-led trade restrictions. The innovation, unveiled on T…
Tom's Hardware TIER_1 English(EN) · Luke James · 2026-05-28 11:10

中国大学为华为的‘LogicFolding’架构量身打造3D芯片设计工具 — 3D设计可提升性能并改善散热管理

The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
Mastodon — fosstodon.org TIER_1 English(EN) · [email protected] · 2026-05-29 06:04

中国大学为华为“LogicFolding”架构打造定制化3D芯片设计工具 — 3D设计可提升性能并改善散热

Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS…

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