English(EN) Researchers at imec published Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration. They evaluated a 3D memory architecture that

imec 研究人员探索 GPU 之上的 3D DRAM 堆叠

作者 PulseAugur 编辑部 · [1 个来源] · 2026-10-26 08:20

imec 的研究人员发表了一篇论文，详细介绍了一种新颖的 3D 内存架构，该架构将 DRAM 芯片垂直堆叠在 GPU 之上。这种方法旨在扩展集成内存解决方案的热设计范围，超越传统的高带宽内存 (HBM) 配置。该研究评估了这种体积 DRAM-on-GPU 集成的热影响。 AI

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Mastodon — mastodon.social TIER_1 English(EN) · sipirtu · 2026-10-26 08:20

imec 研究人员发布 Beyond HBM-on-GPU: 3D 体积 DRAM-on-GPU 集成的热设计包络。他们评估了一种 3D 内存架构，该架构

Researchers at imec published Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration. They evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU. Source: Semiconductor Engineering https:// semiengineering.com/vertical-d ram…

链接 semiengineering.com/vertical-dram-stackin…

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imec 研究人员发布 Beyond HBM-on-GPU: 3D 体积 DRAM-on-GPU 集成的热设计包络。他们评估了一种 3D 内存架构，该架构

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