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English(EN) Let’s focus on the first for now; Assembly.

芯片封装商转向先进技术,将传统业务留给中国

半导体封装公司如ASE和Amkor正从低利润、商品化的组装业务转向对AI和HPC应用至关重要的、高利润的先进封装业务。这一战略举措涉及对CoWoS等先进封装技术的巨额投资,而传统的引线键合产能正日益集中在中国。尽管PC和智能手机需求疲软,中国却出现了引线键合机需求的激增,这表明行业正发生结构性转变。 AI

影响 先进封装对于扩展AI和HPC至关重要,表明供应链正在发生转变以满足未来需求。

排序理由 对半导体封装行业结构性转变的分析,详细介绍了战略投资和市场重新调整。

在 X — SemiAnalysis 阅读 →

AI 生成摘要 · Google Gemini · 来自 10 个来源。 我们如何撰写摘要 →

芯片封装商转向先进技术,将传统业务留给中国

报道来源 [10]

  1. X — SemiAnalysis TIER_1 Italiano(IT) · SemiAnalysis_ ·

    Bottom line:

    Bottom line: Even without a rebound in mainstream demand, the mix shift alone is driving a fundamental re rating opportunity. “Boring” OSATs might not be so boring anymore. (10/10)

  2. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    In simple terms:

    In simple terms: OSATs are becoming critical enablers of advanced semiconductor performance. Higher barriers, higher margins, higher quality businesses. (9/10)

  3. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    This is the key shift:

    This is the key shift: From: Low-margin, commoditized packaging To: High-margin, enabling advanced packaging for AI / HPC applications They’re no longer just “assembly houses.” (8/10)

  4. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Translation:

    Translation: Legacy packaging (low-margin, commoditized) is being pushed down the value chain, largely to China. Meanwhile, ASE and Amkor are moving UP the value chain. (7/10)

  5. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Conversations with ASE make this clear:

    Conversations with ASE make this clear: They are NOT investing in wire bonders. They ARE investing heavily in: • CoWoS and other Advanced packaging. Amkor is doing the same. (6/10)

  6. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Our view, this is a structural shift.

    Our view, this is a structural shift. China isn’t just adding capacity, it’s duplicating legacy, low-end packaging capacity. At the same time, leading OSATs are moving on. (5/10)

  7. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Here’s the interesting part:

    Here’s the interesting part: This is happening despite: • Weak PC demand • Weak smartphone demand • Assembly shifting OUT of China So why is China demand for wire bonders exploding? (4/10) https://t.co/qncNg4JQfw

  8. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    But something is changing.

    But something is changing. KLIC is now seeing : • 90%+ utilization in China And guiding to: • H2’26 China growth +15–20% vs H1 At the Chipbook we have been tracking wire bonder imports into China which are up +108% YoY in March. (3/10) https://t.co/BlkmyrYnx3

  9. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Let’s focus on the first for now; Assembly.

    Let’s focus on the first for now; Assembly. Historically, packaging = low-margin wire bonding. Not exciting. ASE once made up ~40% of $KLIC’s wire bonder business. After the COVID boom, capacity flooded the market and growth stalled. (2/10)

  10. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    OSATs are usually seen as “boring” semiconductor companies. But we’ve been, and remain, bullish on Amkor ($AMKR) and ASE ($3711.TW). Why?

    OSATs are usually seen as “boring” semiconductor companies. But we’ve been, and remain, bullish on Amkor ($AMKR) and ASE ($3711.TW). Why? Because both sides of the OSAT model, Assembly & Test, are starting to shift in a meaningful way. (1/10) 🧵 https://t.co/ecw6YJlRqm