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English(EN) The state of ABF substrates in data center silicon in 2026 — solving the supply crunch and material wall beneath every AI accelerator

AI芯片供应链因ABF基板瓶颈而紧张

作者 PulseAugur 编辑部 · [1 个来源] ·

半导体行业在高性能CPU、GPU和AI加速器必需的ABF基板供应方面面临着关键瓶颈。由于AI热潮，需求激增，Nvidia等公司仅出货数百万台依赖这些基板的AI加速器。供应链高度集中，味之素（Ajinomoto）控制着关键材料味之素积层膜（ABF）超过95%的市场份额。制造商在基板尺寸增大和层数增加以适应日益增长的复杂性方面也遇到了技术挑战，导致翘曲和良率损失等问题。行业正在探索解决方案，包括扩大ABF产能和开发玻璃基板等替代技术。 AI

影响 AI热潮正在给必需的ABF基板供应带来压力，可能限制下一代AI加速器的生产，并推动替代材料的创新。

排序理由 文章讨论了AI加速器的关键供应链瓶颈，影响了主要的芯片制造商和材料供应商。[lever_c_demoted from significant: ic=1 ai=0.7]

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AI芯片供应链因ABF基板瓶颈而紧张

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文章讨论了AI加速器的关键供应链瓶颈，影响了主要的芯片制造商和材料供应商。[lever_c_demoted from significant: ic=1 ai=0.7]
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报道来源 [1]

  1. Tom's Hardware TIER_1 English(EN) · Etiido Uko ·

    2026年数据中心硅基ABF衬底的现状——解决每个AI加速器背后的供应短缺和材料瓶颈

    ABF substrates underpin today’s most advanced AI chips, but soaring demand and expanding accelerator packages are creating new supply and technical bottlenecks that the industry is currently racing to resolve

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