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English(EN) On the supply side, we see materials like T-glass maintain extremely strong demand across both thick products (primarily used in ABF substrates) and thin produc

半导体基板供应链面临极端需求，交货周期长达14个月

作者 PulseAugur 编辑部 · [2 个来源] ·

先进半导体材料，特别是T-glass和ABF基板的供应链正经历极端需求和延长交货期，2026年已全部预订完毕，交货时间延长至12至14个月。尽管新的中国供应商正在进入T-glass市场以缓解单一来源依赖，但像基板CCL（主要来自Resonac Holdings Corporation）等材料的瓶颈依然存在。尽管面临这些挑战，基板CCL的新解决方案预计将于2026年底开始出货，2027年产能翻倍，一些二线供应商已在拍卖现有产能，表明基板制造商的定价环境有利。 AI

影响 由于关键材料和基板短缺，可能导致AI硬件生产延迟。

排序理由 该集群讨论了关键半导体材料和基板的供应链限制和交货周期，影响了未来的生产能力。

在 X — SemiAnalysis 阅读 →

AI 生成摘要 · Google Gemini · 来自 2 个来源。 我们如何撰写摘要 →

半导体基板供应链面临极端需求，交货周期长达14个月

本文如何被排名

Signal score
21 / 100
Composite score across the factors below. Higher = stronger signal that this story matters right now.
Newsworthiness bucket
Significant
该集群讨论了关键半导体材料和基板的供应链限制和交货周期，影响了未来的生产能力。
Source corroboration
2 independent sources
Multiple independent publishers reporting the same story raises confidence that it's real and newsworthy.
Topics
infra
Editorial topic classification. Feeds into how the story surfaces on /topic/<slug> hub pages and into the per-entity coverage mix.
AI-industry relevance
High
Clearly on-topic for AI-industry coverage.
Story freshness
Breaking (< 6h)
Fresh story with cross-source coverage still developing. Ranking may shift as more sources report.

完整方法见我们的编辑标准。

报道来源 [2]

  1. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    从供应端来看，我们看到T-glass等材料在厚产品（主要用于ABF基板）和薄产品中均保持着极其强劲的需求

    On the supply side, we see materials like T-glass maintain extremely strong demand across both thick products (primarily used in ABF substrates) and thin products (mainly used in BT substrates). Even TSMC underscored the impact of T-glass on CoWoS yield and reliability. We see

  2. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    基板供应吃紧：2026年已全部预订，所有六家供应商的总交货期长达12至14个月。更大的封装尺寸（高达9,000–14,000 mm²）

    Substrates have no slack: 2026 is fully booked, and total lead times run 12 to 14 months across all six suppliers. Larger body sizes (up to 9,000–14,000 mm²) and higher layer counts (up to 20–24L) consume more line time per unit as each new ASIC/GPU platform generation evolves. h…

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