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English(EN) For a fixed chip count the diameter collapses. For a 4,096 chip cluster, the worst-case is 24 hops with a 16×16×16 3D torus, but 12 hops with a 4⁶ 6D Torus. Thi

据报道,Google正在为未来的TPU开发六维环面(6D Torus),以增强互连

据报道,Google正在为其Tensor Processing Unit(TPU)互连拓扑进行演进,为未来的TPUv9t等模型从三维环面(3D Torus)转向六维环面(6D Torus)。这种由SemiAnalysis详细介绍的新架构旨在减少通信跳数(hops)并提高双isection带宽,尽管它需要更多的光学器件。Google还为推理专用芯片引入了Boardfly拓扑,同时为TPUv8t等训练专用芯片保留了三维环面。 AI

影响 TPU互连的这种演进可能会显著提升未来AI模型的训练和推理性能。

排序理由 该集群详细介绍了Google TPU互连拓扑的传闻中的架构变更,这是一个技术研究和开发主题。

在 X — SemiAnalysis 阅读 →

AI 生成摘要 · Google Gemini · 来自 8 个来源。 我们如何撰写摘要 →

据报道,Google正在为未来的TPU开发六维环面(6D Torus),以增强互连

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该集群详细介绍了Google TPU互连拓扑的传闻中的架构变更,这是一个技术研究和开发主题。
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报道来源 [8]

  1. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    如需了解ICI网络拓扑,请参阅我们的网络模型(8/8)https://t.co/kqt0IiSiFi

    To learn more about ICI networking topology, please refer to our networking model (8/8) https://t.co/kqt0IiSiFi

  2. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    固定芯片数量下直径会缩小。对于一个4,096芯片集群,最坏情况是24跳(16×16×16三维环面),但4⁶六维环面只需要12跳。这

    For a fixed chip count the diameter collapses. For a 4,096 chip cluster, the worst-case is 24 hops with a 16×16×16 3D torus, but 12 hops with a 4⁶ 6D Torus. This is not the onlye benefit as bisection bandwidth multiplies. However, this all comes at the cost of far more optics

  3. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    机架内部,芯片的布线方式与今天的三维环面完全相同,通过短铜线连接。每颗芯片的另外 6 个邻居都位于六个相邻机架的相同位置

    Inside the rack, chips wire up exactly as in today's 3D torus, over short copper. Each chip's other 6 neighbors sit at the same position in the six adjacent racks, and the rack grid itself forms a second 3D torus, stitched together in optics. (6/8)

  4. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    6D环面不增加对角线,它增加了三个全新的维度,将每个芯片的ICI链接从6个翻倍到12个。它可以被视觉化为一个立方体

    A 6D torus doesn't add diagonals, it adds three entirely new dimensions, doubling each chip's ICI links from 6 to 12. It can be visually represented by a cube of cubes: each small cube is a TPU, each 3D-torus block is a rack. (5/8) https://t.co/5eVR8WBOaX

  5. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    在3D环面中,每个TPU与6个邻居通信(±X, ±Y, ±Z)。想象一个芯片立方体:每个芯片都与其相邻的芯片连接,边缘的芯片会环绕连接到另一侧

    In a 3D torus, each TPU talks to 6 neighbors (±X, ±Y, ±Z). Picture a cube of chips: every chip links to the ones beside it, and chips on an edge wrap around to the opposite edge. That wraparound is what makes it a torus rather than a mesh, and it's what the OCS layer provides. ht…

  6. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    近期传闻暗示谷歌可能会继续采用TPUv9双轨策略,推理专用芯片(TPUv9i)将迭代至新版本B

    Recent rumors hinted that Google will likely maintain this dual track with TPUv9, with the inference-specialized chip (TPUv9i) iterating to a newer version of Boardfly and the training-specialized TPU (TPUv9t) introducing an evolution of 3D Torus called 6D Torus. (3/8)

  7. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    凭借Ironwood (TPUv7),谷歌保留了64芯片立方体的3D环面结构,并通过OCS扩展至9216个互联芯片。今年早些时候在Google Cloud Next 2026期间,

    With Ironwood (TPUv7), Google kept the 3D Torus of 64-chip cubes, scaled via OCS to 9,216 interconnected chips. Earlier this year during Google Cloud Next 2026, the firm unveiled TPUv8t and TPUv8i, with TPUv8i introducing a new ICI topology called Boardfly and TPUv8t sticking to …

  8. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    多年来,Google 一直在改进其最初随 TPUv2 推出的二维环面芯片间互连 (ICI) 网络拓扑,后来扩展到三维环面

    Over the years, Google has been improving its original 2D Torus Inter-Chip-Interconnect (ICI) network topology introduced with TPUv2, later extended to a 3D Torus starting with TPUv4 and v5p. (1/8)🧵 https://t.co/rtU0TkUzZw