包括台积电（TSMC）、英特尔（Intel）、三星（Samsung）和格芯（GlobalFoundries）在内的主要半导体代工厂正在制定不同的共封装光学器件（CPO）策略。随着AI系统日益需要光学互连来克服传统铜线的局限性，这项技术至关重要。这些代工厂采取的多样化方法旨在将光学连接集成到更靠近处理单元的位置，以支持AI基础设施日益增长的需求。 AI
影响 芯片代工厂多样化的CPO策略预示着支持不断增长的AI计算需求的关键基础设施转变。
排序理由 芯片代工厂正在开发新技术（CPO）以满足AI系统的需求，这表明硬件基础设施发生了重大转变。
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