English(EN) Co-Packaged Optics (CPO) foundry roadmaps — breaking down TSMC, Intel, Samsung, and GlobalFoundries' approach to next-generation scale-up connectivity

代工厂竞相开发用于人工智能基础设施的共封装光学技术

作者 PulseAugur 编辑部 · [1 个来源] · 2026-08-03 11:45

领先的半导体代工厂台积电（TSMC）、英特尔（Intel）、三星（Samsung）和格芯（GlobalFoundries）正在制定共封装光学（CPO）策略，以满足人工智能基础设施日益增长的带宽需求。CPO技术将光学接口直接集成到CPU和GPU等处理器内部或旁边，克服了传统电互连在高速数据传输方面的限制。这一转变是由人工智能数据中心对更高带宽密度和更低功耗的需求驱动的，其中台积电的COUPE路线图和先进封装技术尤其具有影响力。 AI

影响通过为处理器提供更高的带宽和更低的功耗，加速了人工智能基础设施的发展。

排序理由主要半导体代工厂为人工智能基础设施的关键赋能技术（CPO）制定的全行业发展和路线图。[lever_c_demoted from significant: ic=1 ai=0.7]

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Newsworthiness bucket: Research; 主要半导体代工厂为人工智能基础设施的关键赋能技术（CPO）制定的全行业发展和路线图。[lever_c_demoted from significant: ic=1 ai=0.7]
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报道来源 [1]

Tom's Hardware TIER_1 English(EN) · Anton Shilov · 2026-08-03 11:45

共封装光学（CPO）代工厂路线图——解析台积电、英特尔、三星和格芯在下一代扩展连接方面的策略

As AI systems outgrow copper interconnects, TSMC, Intel, Samsung Foundry, and GlobalFoundries are pursuing four distinctly different co-packaged optics strategies to bring optical connectivity closer to compute.

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报道来源 [1]

共封装光学（CPO）代工厂路线图——解析台积电、英特尔、三星和格芯在下一代扩展连接方面的策略

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