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English(EN) Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

谷歌据报道选择英特尔EMIB-T用于下一代TPU，挑战台积电的封装主导地位

作者 PulseAugur 编辑部 · [2 个来源] ·

谷歌据报道正将其下一代张量处理单元（TPU）的生产，代号为Humufish，从台积电的CoWoS-L先进封装转向英特尔的EMIB-T技术。此举若属实，将标志着对台积电在AI和HPC处理器封装市场主导地位的重大挑战。英特尔的EMIB-T通过使用嵌入式硅桥而非大型中介层提供了一种替代方案，可能规避光罩尺寸限制并改善对要求严苛的AI加速器的供电。 AI

影响 此次转变可能预示着先进芯片封装领域的竞争加剧，可能影响AI硬件供应链和成本。

排序理由 主要云服务提供商为其AI加速器硬件采购策略的报道性转变，挑战了现有供应商。

在 Tom's Hardware 阅读 →

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谷歌据报道选择英特尔EMIB-T用于下一代TPU，挑战台积电的封装主导地位

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报道来源 [2]

  1. Tom's Hardware TIER_1 English(EN) · Anton Shilov ·

    英特尔EMIB封装技术获得关注，芯片设计商寻求绕开台积电CoWoS限制——谷歌据报道为第九代TPU选择英特尔凸显其吸引力

    Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

  2. Mastodon — mastodon.social TIER_1 English(EN) · [email protected] ·

    英特尔EMIB封装技术获得关注，芯片设计公司寻求绕开台积电CoWoS限制——谷歌据报道为第九代TPU选择英特尔凸显了其优势

    Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's att… Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. Bu…

    链接 tomshardware.com/…/intels-emib-packaging-… tomshardware.com/tech-industry

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