English(EN) Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

谷歌据报道选择英特尔EMIB-T用于新款TPU，挑战台积电封装主导地位

作者 PulseAugur 编辑部 · [1 个来源] · 2026-07-15 14:45

据报道，谷歌正将其下一代TPU（代号Humufish）的开发从台积电的CoWoS封装转向英特尔的EMIB-T技术。此举标志着对台积电在先进芯片封装领域的主导地位的潜在挑战，该领域一直是AI和HPC处理器的行业标准。如果属实，这一决定凸显了供应链多元化日益增长的重要性以及英特尔和台积电在为超大规模用户提供先进封装解决方案方面的竞争格局。 AI

影响这一报道中的转变可能预示着先进芯片封装领域的竞争和创新将加剧，可能影响AI硬件开发和供应链。

排序理由报道称，主要超大规模用户在采用先进芯片封装技术方面发生了转变。[lever_c_demoted from significant: ic=1 ai=0.7]

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报道来源 [1]

Tom's Hardware TIER_1 English(EN) · Anton Shilov · 2026-07-15 14:45

Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

Google has reportedly chosen Intel's EMIB-T over TSMC's CoWoS-L for its next-generation TPU, codenamed Humufish. But will Google be alone in its alleged decision?

报道来源 [1]

Intel's EMIB packaging gains traction as chip designers look to skirt TSMC's CoWoS constraints — Google's reported decision for 9th-gen TPUs highlights Intel's attractive alternative

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