HBM5
PulseAugur coverage of HBM5 — every cluster mentioning HBM5 across labs, papers, and developer communities, ranked by signal.
- 2026-07-27 product_launch Samsung Electronics announced that its next-generation HBM5 memory will use a 2nm GAA process, offering over 50% speed improvement. source
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Samsung Electronics to use 2nm GAA for HBM5, boosting speed over 50%
Samsung Electronics has confirmed that its next-generation HBM5 memory will utilize a 2nm Gate-All-Around (GAA) process, promising over a 50% speed increase compared to HBM4E. This advanced manufacturing node is expecte…
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Samsung and Nvidia Discuss HBM4, Foundry, and Future Chip Tech
Samsung Electronics' chip division head, Jun, met with NVIDIA CEO Jensen Huang to discuss potential collaborations. The discussions covered short-term partnerships in HBM4 and foundry services, as well as ongoing work o…
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Samsung and SK Hynix race to cool next-gen AI memory
Samsung has unveiled a mockup of its HBM5 memory at Computex 2026, featuring a new Heat Path Block (HPB) cooling system. This development places Samsung in direct thermal management competition with SK hynix, which rece…
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SK hynix unveils integrated cooling for AI memory
SK hynix has introduced 'iHBM,' a novel thermal architecture designed to address the critical heating issues in High-Bandwidth Memory (HBM) used for AI acceleration. This technology integrates cooling elements directly …