TSMC is significantly increasing its advanced packaging capacity, specifically for its CoWoS technology, to meet soaring demand. The company aims for a monthly CoWoS production capacity of at least 200,000 wafers by 2027, with projections suggesting it could reach 240,000-260,000 wafers by the end of that year. This aggressive expansion involves 24-hour construction schedules at new facilities, though the final allocation of equipment orders remains pending, causing some uncertainty among suppliers. AI
IMPACT Increased advanced packaging capacity is crucial for supporting the production of AI accelerators and high-performance computing chips.
RANK_REASON The article details a significant expansion of advanced packaging capacity by a major semiconductor manufacturer. [lever_c_demoted from significant: ic=1 ai=0.7]
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