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English(EN) Huawei Produces 122TB SSD Using Proprietary Chip Packaging Technology

华为推出122TB固态硬盘，采用新型封装技术规避美国芯片制裁

作者 PulseAugur 编辑部 · [3 个来源] ·

华为已开发出一种新的122TB固态硬盘，用于数据中心和AI推理，规避了美国对先进3D NAND芯片的制裁。该公司采用专有的板上芯片（DoB）封装技术，将NAND芯片直接安装在PCB上，在不依赖外国受制裁技术的情况下提高了密度。这项创新使华为能够使用密度较低的中国制造的NAND芯片来实现高容量，可能促进中国半导体行业的更大独立性。 AI

影响 支持AI基础设施高密度存储解决方案的开发，可能减少对外国技术的依赖。

排序理由 一款采用新型技术规避地缘政治制裁的高容量固态硬盘产品发布。

在 Pandaily 阅读 →

AI 生成摘要 · Google Gemini · 来自 3 个来源。 我们如何撰写摘要 →

华为推出122TB固态硬盘，采用新型封装技术规避美国芯片制裁

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一款采用新型技术规避地缘政治制裁的高容量固态硬盘产品发布。
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报道来源 [3]

  1. Tom's Hardware TIER_1 English(EN) · Jowi Morales ·

    华为开发出122TB固态硬盘，采用新技术封装以规避美国对3D NAND芯片的制裁——中国公司开发专有技术，在更小的空间内塞入更多NAND芯片

    Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage dev…

  2. Pandaily TIER_1 English(EN) · [email protected] (Pandaily) ·

    华为利用专有芯片封装技术生产122TB固态硬盘

    Huawei develops 122TB SSD using proprietary chip packaging technology amid semiconductor restrictions.

  3. Mastodon — fosstodon.org TIER_1 English(EN) · [email protected] ·

    华为开发出122TB固态硬盘，采用新技术封装以规避美国对3D NAND芯片的制裁——中国杉木……华为开发了一种新的板上芯片封装技术，该技术

    Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese fir… Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count…

    链接 tomshardware.com/…/huawei-introduces-122t… tomshardware.com/pc-components

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