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English(EN) Analyzing Intel's EMIB and Foveros advanced packaging roadmaps Intel was the first large chipmaker to start using advanced packaging methods in 2017 – 2019. But

Formlabs推出用户友好型3D打印机；英特尔推进芯片封装

作者 PulseAugur 编辑部 · [2 个来源] ·

Formlabs发布了Form Studio 1，这是一款售价699美元的台式3D打印机，旨在易于使用。另外，英特尔正在继续开发其先进封装技术EMIB和Foveros，这些技术最早于2017-2019年实施，重点是未来的芯片扩展。 AI

排序理由 该集群包含来自不同公司的两个不同的产品/技术公告，其中没有一个符合前沿发布、重要或研究的标准。

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Formlabs推出用户友好型3D打印机；英特尔推进芯片封装

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该集群包含来自不同公司的两个不同的产品/技术公告，其中没有一个符合前沿发布、重要或研究的标准。
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报道来源 [2]

  1. Mastodon — mastodon.social TIER_1 English(EN) · [email protected] ·

    Formlabs 推出面向普通用户的 3D 打印机 Form Studio 1 售价 699 美元，桌面大小，仅轻微异味。https://www.wired.com

    Formlabs Has a 3D Printer for Normies The Form Studio 1 is a $699 desktop-sized printer that fits on a desk and only stinks a little bit. https://www. wired.com/story/formlabs-has-a -3d-printer-for-normies/ # Tech # Technology # TechNews # AI # Gadgets # Software # Cybersecurity …

    链接 wired.com/…/formlabs-has-a-3d-printer-for…
  2. Mastodon — mastodon.social TIER_1 English(EN) · [email protected] ·

    分析英特尔的EMIB和Foveros先进封装路线图 英特尔是首家在2017-2019年开始使用先进封装方法的芯片制造商。但

    Analyzing Intel's EMIB and Foveros advanced packaging roadmaps Intel was the first large chipmaker to start using advanced packaging methods in 2017 – 2019. But where are Intel's EMIB and Foveros technologies today and where are they heading? https://www. tomshardware.com/tech-in…

    链接 tomshardware.com/…/analyzing-intels-emib-… tomshardware.com/tech-industry

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