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English(EN) AI chip delivery chokepoints are shifting from raw wafer fab to advanced packaging, and TSMC is diversifying away from Taiwan to fix it. A new $2 billion, five-

台积电与GlobalFoundries合作,提升AI芯片封装产能

台积电正通过将先进封装能力多元化至台湾以外地区,来解决AI芯片交付瓶颈问题。该公司已与一家美国制造商GlobalFoundries达成一项为期五年、价值20亿美元的协议。根据这项合作,GlobalFoundries将在其纽约工厂生产台积电CoWoS封装技术所需的关键硅中介层,预计将于2028年实现量产。 AI

影响 这项合作旨在缓解AI芯片供应链的限制,可能加快高性能AI加速器的可用性。

排序理由 涉及一家主要半导体制造商为AI芯片实现生产多元化的重大行业举措。[lever_c_demoted from significant: ic=1 ai=0.7]

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台积电与GlobalFoundries合作,提升AI芯片封装产能

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涉及一家主要半导体制造商为AI芯片实现生产多元化的重大行业举措。[lever_c_demoted from significant: ic=1 ai=0.7]
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报道来源 [1]

  1. Mastodon — mastodon.social TIER_1 English(EN) · asiaai ·

    AI芯片的供应瓶颈正从晶圆厂转向先进封装,台积电正采取措施分散台湾以外的产能以解决此问题。一家新的、投资20亿美元的、为期五年的...

    AI chip delivery chokepoints are shifting from raw wafer fab to advanced packaging, and TSMC is diversifying away from Taiwan to fix it. A new $2 billion, five-year deal tapped US-based GlobalFoundries to produce critical silicon interposers for TSMC's CoWoS packaging. By 2028, G…