ENTITY
Kirin 9030
Kirin 9030
PulseAugur coverage of Kirin 9030 — every cluster mentioning Kirin 9030 across labs, papers, and developer communities, ranked by signal.
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TIER MIX · 90D
TOPICS
RECENT · PAGE 1/1 · 2 TOTAL
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SMIC's 7nm node advances without EUV, but lags in performance
SMIC's third-generation 7nm-class fabrication technology (N+3) has achieved a smaller metal pitch than Intel's 18A and a higher transistor density than TSMC's N6, notably without using EUV lithography. This represents a…
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Chinese SMIC 7nm node outpaces Intel 18A without EUV, analysis finds
SemiAnalysis has performed a detailed examination of Huawei's Kirin 9030 chip, revealing its metal pitch measures 32.5 nanometers. This dimension is tighter than that of Intel's 18A node, which utilizes EUV technology. …