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Chinese SMIC 7nm node outpaces Intel 18A without EUV, analysis finds

By PulseAugur Editorial · [2 sources] ·

SemiAnalysis has performed a detailed examination of Huawei's Kirin 9030 chip, revealing its metal pitch measures 32.5 nanometers. This dimension is tighter than that of Intel's 18A node, which utilizes EUV technology. The findings suggest that SMIC, a Chinese foundry, may be outperforming Intel's leading-edge process without access to EUV, raising questions about the current state of semiconductor manufacturing capabilities. AI

IMPACT Analysis suggests potential shifts in leading-edge semiconductor manufacturing capabilities, impacting future AI hardware development.

RANK_REASON Analysis of semiconductor manufacturing nodes and capabilities.

Read on X — SemiAnalysis →

AI-generated summary · Google Gemini · from 2 sources. How we write summaries →

Chinese SMIC 7nm node outpaces Intel 18A without EUV, analysis finds

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Analysis of semiconductor manufacturing nodes and capabilities.
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COVERAGE [2]

  1. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Full breakdown here: https://t.co/xOHII2gNXh

    Full breakdown here: https://t.co/xOHII2gNXh

  2. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    We cut open the Kirin 9030 and put it under an electron microscope.

    We cut open the Kirin 9030 and put it under an electron microscope. The smallest metal pitch measures 32.5 nanometers. That is tighter than Intel 18A, their brand new leading edge node. A Chinese fab with no EUV is out-pitching Intel's EUV node by roughly 10 percent. What's http…

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