HBM3E
PulseAugur coverage of HBM3E — every cluster mentioning HBM3E across labs, papers, and developer communities, ranked by signal.
5 day(s) with sentiment data
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CXMT begins HBM3E risk production, samples with T-Head and Cambricon
ChangXin Memory Technologies (CXMT) has initiated risk production for its HBM3E memory chips. Initial samples are currently undergoing qualification by Alibaba's T-Head and Cambricon. While specific details on yields, p…
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Huawei unveils AI chip; Meta, Google advance models; AI agents used in ransomware
Huawei has unveiled its new Threadripper Halo chip, designed for AI researchers and featuring substantial memory bandwidth and capacity. In other AI news, Meta is preparing to release its Muse model with open weights, a…
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AMD launches Threadripper Halo for local AI, Hugging Face deemed too vital for Nvidia acquisition
AMD has launched its Threadripper Halo workstation, designed for researchers needing significant local AI processing power with up to 576 GB of HBM3e memory. In other AI news, Hugging Face is considered too vital to be …
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AMD launches Threadripper Halo Station for local AI development · 4 sources tracked
AMD has unveiled its Threadripper Halo Station, a high-performance AI workstation designed for local model training and inference. This powerful machine features a 96-core Threadripper Pro 9995WX CPU and dual liquid-coo…
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Huawei unveils Atlas 950 SuperPoD servers with 1,024 NPUs and 256TB memory · 4 sources tracked
Huawei has showcased its Atlas 950 SuperPoD servers, a system comprising 1,024 NPUs designed for AI workloads. The system features extensive inter-rack connectivity, with each of the 32 LRS units utilizing 4x100G connec…
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China's ChangXin Memory Technologies starts HBM3E production, challenging US and Korea
ChangXin Memory Technologies has initiated small-scale production of HBM3E memory chips, aiming to challenge the established dominance of South Korea and the United States in this critical technology sector. This move i…
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China's CXMT begins HBM3E production, aiming to close AI memory gap · 2 sources tracked
China's leading memory manufacturer, ChangXin Memory Technologies (CXMT), has begun risk production of HBM3E chips, a critical component for advanced AI processors. While currently a generation behind industry leaders, …
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Microsoft details Maia 200 AI accelerator for Azure data centers
Microsoft has unveiled details about its Maia 200 AI accelerator, designed for its Azure data centers. This second-generation chip, built on TSMC's 3nm process, features a 750W TDP and utilizes a Software Defined Local …
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AI hardware advances: Cerebras stacks DRAM, HBM faces growing costs
At Hot Chips 2026, leading memory and chip manufacturers discussed the future of AI hardware, focusing on advancements in wafer-scale processing and High Bandwidth Memory (HBM). Cerebras unveiled its roadmap for stacked…
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Intel GPU challenges NVIDIA, Apple sues OpenAI, and agentic ransomware emerges
Intel has released a new GPU, the Arc Pro B70, which significantly outperforms NVIDIA's flagship RTX 5090D and RTX 4090D in AI inference tasks at a fraction of the cost. While Intel's hardware shows promise for inferenc…
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GLM-5.2 deployment on 8x B200 GPUs favors NVFP4 for optimal throughput
A technical analysis reveals that deploying the GLM-5.2 model on 8x NVIDIA B200 GPUs is most efficient using NVFP4 precision across four GPUs, rather than the more intuitive FP8 precision across all eight. This configur…
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Intel patents XBM memory architecture to cut AI chip costs
Intel has patented a new memory architecture called XBM (Cross-Batch Memory) designed to reduce the cost and complexity of AI memory systems. XBM aims to bypass the need for expensive silicon interposers used in High Ba…
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Public funds buy billions in stocks, Micron advances next-gen memory
Publicly offered funds have significantly increased their self-purchases of their own products, signaling strong confidence in the stock market. These funds have invested over 7 billion yuan this year, with a particular…
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Micron Technology targets late 2027 for next-gen DRAM/NAND mass production
Micron Technology announced that its next-generation DRAM and NAND memory nodes are progressing well, with mass production expected to begin in the second half of 2027. The company also reported that its HBM4 12-layer p…
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DRAM industry revenue surges 81% on rising contract prices
The DRAM industry experienced an 81% revenue increase in the first quarter, reaching $97 billion, driven by a significant 93-98% rise in contract prices. This surge is attributed to expanding AI applications, which are …
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AMD launches MI350P PCIe AI card, claiming 40% speed advantage over Nvidia H200
AMD has introduced the Instinct MI350P, a new PCIe AI accelerator card featuring 144GB of HBM3E memory. This card is designed as a direct upgrade for air-cooled servers and claims to offer a significant performance adva…
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PCIe 8.0 draft targets 1 TB/s, AMD launches new AI GPU, EU delays AI Act rules
The PCI-SIG has released a draft specification for PCIe 8.0, aiming to double the data transfer rate to 1 TB/s per lane. This advancement is crucial for supporting the increasing demands of AI and high-performance compu…
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AMD launches Instinct MI350P GPU for enterprise AI workloads
AMD has introduced its new Instinct MI350P GPU, designed for enterprises exploring AI applications. This dual-slot card features 144 GB of HBM3e memory and offers up to 4.6 teraFLOPS of FP4 performance. The MI350P aims …
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Micron's Tongluo fab capacity may exceed estimates with EUV upgrades
Micron is acquiring the PSMC P5 Tongluo fab in Taiwan, with plans to significantly expand its wafer output by 2028. The facility's Section B is being designed for EUV compatibility and advanced HBM manufacturing, potent…