GlobalFoundries has announced its new 7nm-class FDX Fusion manufacturing node, marking a return to advanced fabrication after abandoning FinFET technology years prior. This new node utilizes planar transistors and FD-SOI technology, offering improved transistor density over its previous 22FDX process. FDX Fusion is designed for applications requiring high integration, cost efficiency, and low power consumption, such as automotive, edge AI, and industrial devices, with production slated to begin in 2028. AI
IMPACT This new node could enable more integrated and power-efficient chips for edge AI applications, potentially accelerating the deployment of AI capabilities in devices.
RANK_REASON Announcement of a new semiconductor manufacturing node by a major foundry. [lever_c_demoted from significant: ic=1 ai=0.7]
- 22FDX
- BMW
- Bosch
- CEA-Leti
- Dresden
- FDX Fusion
- FinFET
- GlobalFoundries
- IBM
- Infineon
- MIPS architecture
- RISC-V
- Sébastien Dauvé
- Siemens
- Tesla
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