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GlobalFoundries unveils 7nm-class FD-SOI process for edge AI and automotive

By PulseAugur Editorial · [1 sources] ·

GlobalFoundries has announced its new 7nm-class FDX Fusion manufacturing node, marking a return to advanced fabrication after abandoning FinFET technology years prior. This new node utilizes planar transistors and FD-SOI technology, offering improved transistor density over its previous 22FDX process. FDX Fusion is designed for applications requiring high integration, cost efficiency, and low power consumption, such as automotive, edge AI, and industrial devices, with production slated to begin in 2028. AI

IMPACT This new node could enable more integrated and power-efficient chips for edge AI applications, potentially accelerating the deployment of AI capabilities in devices.

RANK_REASON Announcement of a new semiconductor manufacturing node by a major foundry. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on Tom's Hardware →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

GlobalFoundries unveils 7nm-class FD-SOI process for edge AI and automotive

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15 / 100
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Research
Announcement of a new semiconductor manufacturing node by a major foundry. [lever_c_demoted from significant: ic=1 ai=0.7]
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Only one publisher covered this so far. Single-source stories can still rank when the publisher is high-authority, but they lack cross-source corroboration.
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infra, product
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High
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COVERAGE [1]

  1. Tom's Hardware TIER_1 English(EN) · Anton Shilov ·

    GlobalFoundries unveils 7nm-class FDX Fusion node — comes 7 years after firm abandoned FinFET

    GlobalFoundries returns to advanced FD-SOI development with 7nm-class FDX Fusion process — production planned for 2028.

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