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Samsung custom HBM4 shrinks interface, frees GPU die space · 3 sources tracked

By PulseAugur Editorial · [3 sources] ·

Samsung is developing custom High Bandwidth Memory (HBM) solutions that significantly reduce the physical footprint and improve efficiency compared to standard HBM4. These custom designs replace wide PHY interfaces with compact die-to-die links, freeing up valuable space on compute dies. This optimization is particularly relevant for high-performance GPUs like Nvidia's Rubin, where memory interfacing currently consumes a substantial portion of the compute die. AI

IMPACT Custom HBM solutions could accelerate AI hardware development by increasing compute die efficiency and bandwidth.

RANK_REASON The cluster discusses advancements in memory technology (HBM4) and its impact on major hardware products (Nvidia GPUs), indicating a significant industry development.

Read on X — SemiAnalysis →

AI-generated summary · Google Gemini · from 3 sources. How we write summaries →

Samsung custom HBM4 shrinks interface, frees GPU die space · 3 sources tracked

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The cluster discusses advancements in memory technology (HBM4) and its impact on major hardware products (Nvidia GPUs), indicating a significant industry development.
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3 independent sources
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infra, product
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COVERAGE [3]

  1. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    And once the base die sits on an advanced logic process, it can do more than relay signals. Samsung points to SRAM repair resources, monitoring, connections to

    And once the base die sits on an advanced logic process, it can do more than relay signals. Samsung points to SRAM repair resources, monitoring, connections to external memory, even selected computation under the DRAM become possible with a custom controller. To learn more about

  2. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Custom HBM tackles this issue head on. First, the wide standard PHY gets replaced with a compact die-to-die link. Samsung shows that its standard HBM4 PHY occup

    Custom HBM tackles this issue head on. First, the wide standard PHY gets replaced with a compact die-to-die link. Samsung shows that its standard HBM4 PHY occupies 8mm x 4mm, while the custom D2D interface needs just 8.5mm x 1.5mm, roughly 60% less area. The better D2D interface …

  3. X — SemiAnalysis TIER_1 English(EN) · SemiAnalysis_ ·

    Real estate on the compute die is extremely valuable, yet a surprising share of it is spent just interfacing with memory. We estimate that HBM4 controllers and

    Real estate on the compute die is extremely valuable, yet a surprising share of it is spent just interfacing with memory. We estimate that HBM4 controllers and PHYs take up roughly 16% of Nvidia's Rubin compute die. That is a lot of leading-edge silicon spent talking to memory ht…

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