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ENTITY dynamic random-access memory

dynamic random-access memory

PulseAugur coverage of dynamic random-access memory — every cluster mentioning dynamic random-access memory across labs, papers, and developer communities, ranked by signal.

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165 over 90d
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  1. 2026-07-03 product_launch Samsung Electronics is negotiating to increase DRAM prices by up to 20% for the third quarter. source
  2. 2026-07-02 product_launch Beijing Junzheng forecasts continued price increases for DRAM and SRAM due to supply constraints. source
SENTIMENT · 30D

26 day(s) with sentiment data

RECENT · PAGE 1/9 · 165 TOTAL
  1. RESEARCH · CL_196527 ·

    Intel CEO hints at return to memory business, exploring CPU-memory stacking

    Intel CEO Pat Gelsinger has indicated a potential return to the memory market, a sector the company previously exited. Gelsinger highlighted that memory is now a strategic asset ripe for innovation, suggesting possibili…

  2. TOOL · CL_193097 ·

    Apple plans 2026 hardware cuts amid DRAM shortage; Rekordbox vulnerability disclosed

    Apple Inc. is reportedly reducing its hardware shipment targets for 2026, citing anticipated shortages of dynamic random-access memory (DRAM). This adjustment comes from analyst Ming-Chi Kuo, who also commented on TSMC'…

  3. RESEARCH · CL_192599 ·

    DRAM and HBM capacity for 2027 reportedly sold out, signaling price hikes

    The entire supply of DRAM and High Bandwidth Memory for 2027 has reportedly been sold out, with no additional capacity planned. This shortage is expected to lead to further price increases for consumers in the near futu…

  4. RESEARCH · CL_190993 ·

    Apple tests Chinese AI and memory chips amid supply crunch · 1 source tracked

    Apple is reportedly testing memory chips from Chinese manufacturer Changxin Memory Technologies (CXMT) for use in iPhones and MacBooks, aiming to alleviate a global DRAM shortage exacerbated by AI demand. Simultaneously…

  5. SIGNIFICANT · CL_190753 ·

    AI demand tightens memory supply, AMD bets on specialized inference chips · 4 sources tracked

    The burgeoning demand for AI, particularly for High Bandwidth Memory (HBM) and DRAM, is creating significant supply constraints across the semiconductor industry. This surge is prompting manufacturers to prioritize AI i…

  6. RESEARCH · CL_189359 ·

    AI demand sells out 2027 DRAM and HBM capacity, driving price hikes

    Major memory manufacturers have reportedly sold out their DRAM and HBM capacity for 2027, largely due to demand from AI companies. This sell-out, combined with existing long-term purchasing agreements, is anticipated to…

  7. RESEARCH · CL_187909 ·

    SK Hynix invests $38B in new AI memory chip factories in South Korea

    SK Hynix is investing $38.1 billion to construct two new memory chip facilities in South Korea. These factories, one in Yongin for HBM and DRAM and another in Cheongju for NAND flash, are intended to meet the surging de…

  8. RESEARCH · CL_188615 ·

    AI infrastructure evolves to integrate storage for LLM inference

    The AI infrastructure landscape is shifting from solely focusing on GPU compute to a more integrated approach involving compute, networking, memory, and storage. This evolution is driven by the demands of large language…

  9. TOOL · CL_186895 ·

    Apple faces $1B chip shortage; Samsung Galaxy pre-orders end

    Apple is reportedly facing a $1 billion shortage of iPhone 18 Pro chips due to a lack of DRAM, delaying their packaging. Meanwhile, Samsung's latest smartphones and smartwatches are launching, with pre-order discounts e…

  10. TOOL · CL_186245 ·

    Apple's iPhone 18 Pro Launch Threatened by $1B DRAM Shortage

    Apple is facing significant challenges in securing DRAM for its upcoming iPhone 18 Pro, with approximately $1 billion worth of processor wafers awaiting packaging. The global shortage of memory components, particularly …

  11. TOOL · CL_185577 ·

    SK Hynix, SanDisk unveil High Bandwidth Flash for AI inference memory wall

    SK Hynix and SanDisk have collaborated to develop High Bandwidth Flash (HBF), a new memory tier designed to address the memory wall challenges in AI inference. HBF places large-capacity NAND flash memory close to variou…

  12. RESEARCH · CL_184919 ·

    China's memory chip makers diverge amid US sanctions and IPO success

    China's domestic memory chip industry has seen significant development over the past decade, with companies like Yangtze Memory Technology Corp (YTC) and Changxin Memory Technologies (CXMT) emerging. While both started …

  13. RESEARCH · CL_184922 ·

    Musk's wealth plummets, Changxin rejects Apple's price cuts, DeepSeek seeks 50B yuan · 1 source tracked

    Elon Musk's personal wealth saw a significant drop of approximately 2.45 trillion yuan in July, equivalent to losing the fortunes of two Jensen Huangs. In the tech sector, Changxin отказался to meet Apple's lower DRAM p…

  14. SIGNIFICANT · CL_184158 ·

    China's CXMT aims for 30% DRAM market share by 2030 with new fab

    China's Changxin Memory Technologies (CXMT) is planning to significantly expand its dynamic random-access memory (DRAM) production capacity by building a sixth mega-fab. This expansion, supported by government funding, …

  15. TOOL · CL_182779 ·

    DeepSeek-V4 Model Demands More DRAM, Potentially Driving Up Prices

    A user on Reddit's r/LocalLLaMA subreddit is discussing the significant DRAM requirements for running the DeepSeek-V4-Flash-0731-GGUF model. The user notes that their 128GB of DRAM is insufficient for this powerful mode…

  16. RESEARCH · CL_181258 ·

    SoftBank's Q1 Profit Misses Expectations Amid AI Office Investments

    SoftBank Group reported a net profit of 150.07 billion yen for the first quarter of its 2027 fiscal year, slightly missing market expectations. The company maintained its full-year forecasts for net sales, operating pro…

  17. RESEARCH · CL_181259 ·

    NVIDIA re-evaluates Rubin Ultra HBM config amid DRAM shortage fears

    NVIDIA is re-evaluating the High Bandwidth Memory (HBM) configuration for its upcoming Rubin Ultra GPU due to anticipated ongoing DRAM shortages extending to 2027. The company is considering lower HBM configurations, in…

  18. TOOL · CL_181241 ·

    MCP, eMMC, and eMCP: Understanding Integrated Memory Technologies

    This article delves into the distinctions between Multi-Chip Package (MCP), embedded MultiMediaCard (eMMC), and embedded Multi-Chip Package (eMCP) technologies. MCP is a packaging method that integrates multiple chips l…

  19. RESEARCH · CL_181187 ·

    Samsung Electronics reclaims DRAM market lead; Micron Technology challenges SK Hynix

    Micron Technology is projected to become the second-largest DRAM supplier, with revenues quadrupling since Q2 2025, according to Counterpoint Research. Samsung Electronics has reclaimed the top spot in the DRAM market a…

  20. SIGNIFICANT · CL_177932 ·

    AI datacenter boom strains consumer electronics supply chains

    The rapid expansion of AI datacenters in the US is causing significant supply chain disruptions, particularly for high-end DRAM memory. This demand surge is impacting the availability of consumer electronics, with repor…