The supply chain for advanced semiconductor materials, particularly T-glass and ABF substrates, is experiencing extreme demand and extended lead times, with 2026 fully booked and delivery times stretching 12 to 14 months. While new Chinese vendors are entering the T-glass market to alleviate single-source dependency, bottlenecks persist with materials like substrate CCL, primarily sourced from Resonac Holdings Corporation. Despite these challenges, new solutions for substrate CCL are expected to begin shipments by late 2026, with capacity doubling in 2027, and some second-tier suppliers are already auctioning off available capacity, indicating a favorable pricing environment for substrate makers. AI
IMPACT Potential delays in AI hardware production due to critical material and substrate shortages.
RANK_REASON The cluster discusses supply chain constraints and lead times for critical semiconductor materials and substrates, impacting future production capacity.
- ABF substrates
- Ajinomoto Build Factory
- application-specific integrated circuit
- BT substrates
- EMCompress
- graphics processing unit
- Nittobo
- Resonac Holdings Corporation
- T-glass
- TSMC
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