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中文(ZH) 谦合益邦打造全球首款4层3D DRAM存算一体芯片

Qianhe Yibang unveils world's first 4-layer 3D DRAM in-memory computing chip

Qianhe Yibang, a startup incubated by NetEase, has successfully developed and tested the world's first 4-layer 3D DRAM stacked in-memory computing chip. This chip utilizes a novel 3D integrated native computing architecture, significantly overcoming the limitations of traditional separated compute and memory architectures. The breakthrough promises a tenfold improvement in data access bandwidth, power consumption, latency, and processing throughput, while reducing costs, making it suitable for demanding applications like cloud gaming. AI

IMPACT This chip's advancements in memory bandwidth and latency could accelerate AI training and inference by reducing the 'memory wall' bottleneck.

RANK_REASON This is a novel hardware architecture release from a startup focused on AI-adjacent computing, representing a significant technological advancement. [lever_c_demoted from frontier_release: ic=1 ai=0.7]

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Qianhe Yibang unveils world's first 4-layer 3D DRAM in-memory computing chip

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  1. 雷峰网 (Leiphone) TIER_1 中文(ZH) ·

    Qianhe Yibang Creates the World's First 4-Layer 3D DRAM Compute-in-Memory Chip

    <p>近日,3D存算一体芯片领军企业谦合益邦宣布,其自主研发的全球首款4层3D DRAM堆叠存算一体芯片成功回片并点亮,标志着4层3D DRAM堆叠存算一体芯片从技术验证正式迈入工程落地阶段。</p><p>该芯片采用谦合益邦自研的全新三维集成原生计算架构与3D DRAM堆叠技术,在全球范围内首次实现4层芯片在垂直方向的高密度集成,将计算单元与存储单元在三维空间中深度融合,从根本上突破了传统平面架构下计算与存储分离带来的“内存墙”瓶颈。</p><p>在此基础上,该芯片以逻辑层为基底、4层DRAM堆叠其上的&quot;4+1&quot;三维堆叠架构,将垂直扩…