At the 2026 FMS Conference, SK Hynix and SanDisk showcased advancements in High Bandwidth Flash (HBF) technology, designed to enhance AI inference capabilities. SK Hynix introduced new memory tiers, including G1.5 HBF with terabyte-scale bandwidth, aimed at optimizing AI performance and cost. SanDisk detailed their latest NAND flash chips and their collaboration with SK Hynix on HBF, which stacks NAND chips similarly to HBM to provide high-capacity, high-performance storage solutions for AI accelerators. AI
IMPACT These HBF advancements promise to significantly boost AI inference performance and efficiency, potentially lowering costs and enabling more powerful AI applications on various devices.
RANK_REASON The cluster details advancements in High Bandwidth Flash technology presented at a conference, including new memory tiers and specifications, which falls under research and development in storage and memory for AI applications. [lever_c_demoted from research: ic=1 ai=0.7]
- 2026 FMS Conference
- AI inference
- Alper Ilkbahar
- David Patterson
- DRAM
- High Bandwidth Flash
- High Bandwidth Memory
- Jim Keller
- Kang Uksong
- Khurram Ismail
- Kim Chunsung
- NAND flash
- Raja Koduri
- Samsung
- SanDisk
- SK Hynix
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