Intel has appointed Seok-Hee Lee, former CEO of SK hynix, to lead its advanced packaging division within Intel Foundry. This move signifies Intel's strategic decision to establish advanced packaging as a distinct business unit, aiming to enhance its capabilities in integrating components like High Bandwidth Memory (HBM) with logic dies for AI accelerators. The company is investing heavily in this area, with packaging revenue projected to exceed $1 billion and gross margins near 40%, despite Intel Foundry's overall significant losses. AI
IMPACT This move could enhance Intel's ability to integrate critical AI components like HBM, potentially improving performance and competitiveness in the AI hardware market.
RANK_REASON Hiring of a high-profile executive from a major competitor to lead a newly formed, strategically important business unit within a leading semiconductor company.
- CoWoS
- David Zinsner
- High Bandwidth Memory
- Intel
- Intel Foundry
- Lip-Bu Tan
- Naga Chandrasekaran
- Navid Shahriari
- Seok-Hee Lee
- Seoul Economic Daily
- SK hynix
- SK On
- TSMC
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