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ENTITY Naga Chandrasekaran

Naga Chandrasekaran

PulseAugur coverage of Naga Chandrasekaran — every cluster mentioning Naga Chandrasekaran across labs, papers, and developer communities, ranked by signal.

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RECENT · PAGE 1/1 · 7 TOTAL
  1. RESEARCH · CL_314307 ·

    Intel installs production tools at Arizona fab, confirms High-NA EUV integration

    Intel is advancing its semiconductor manufacturing capabilities in the United States, with production tools now being installed at its Fab 62 facility in Arizona, slated for mass production by late 2028. The company has…

  2. RESEARCH · CL_144365 ·

    Intel invests $5.7B in Ireland to boost AI chip production

    Intel is investing €5 billion ($5.7 billion) to expand chip production at its Leixlip campus in Ireland, focusing on upgrading existing facilities to produce Intel 3 wafers for Xeon 6 and future server processors. This …

  3. SIGNIFICANT · CL_142521 ·

    Intel invests $5.7B to expand Ireland chip fab for Xeon 6

    Intel is investing €5 billion (approximately $5.7 billion) to expand and modernize its semiconductor manufacturing facility in Ireland. This investment aims to increase production capacity for its Xeon 6 processors and …

  4. SIGNIFICANT · CL_127660 ·

    Nvidia, Intel tout US chip production, but packaging remains offshore

    Nvidia and Intel are highlighting their contributions to a domestic U.S. chip supply chain, emphasizing U.S.-based wafer production for advanced AI components like Nvidia's Blackwell. However, a critical gap remains as …

  5. SIGNIFICANT · CL_100640 ·

    Intel taps ex-SK Hynix chief to lead new advanced packaging unit

    Intel has appointed Seok-Hee Lee, former CEO of SK hynix, to lead its advanced packaging division within Intel Foundry. This move signifies Intel's strategic decision to establish advanced packaging as a distinct busine…

  6. SIGNIFICANT · CL_97333 ·

    Intel re-evaluates fab roadmap amid capacity crunch and critical deadlines

    Intel is re-evaluating its chip manufacturing roadmap, facing capacity constraints after previously canceling expansion plans. The company's future fab development, particularly for its 14A process node, hinges on criti…

  7. RESEARCH · CL_95646 ·

    Intel details future chip tech: CFET, GaN integration, and new interconnects

    Intel has unveiled advancements in its chip manufacturing technology, including the Intel 18A-P process node which offers improved performance and power efficiency over its predecessor. The company also detailed progres…