Zhengye Technology: Currently has no equipment for non-destructive internal testing of stacked chip packaging.
Zhengye Technology has stated that they currently do not offer equipment for non-destructive internal inspection of stacked chip packaging. Their existing X-RAY detection equipment is primarily used for inspecting defects within lithium batteries, though they are exploring applications in new sectors like electronics manufacturing. Separately, Tianma Microelectronics has denied rumors about BOE potentially acquiring them. AI