ENTITY Zhengye Technology

Zhengye Technology

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COMMENTARY · CL_56640 · May 28 · 07:18

Zhengye Technology Lacks Stacked Chip Inspection Gear; Tianma Denies BOE Acquisition Rumors

Zhengye Technology has stated that they currently do not offer equipment for non-destructive internal inspection of stacked chip packaging. Their existing X-RAY detection equipment is primarily used for inspecting defec…

Zhengye Technology Lacks Stacked Chip Inspection Gear; Tianma Denies BOE Acquisition Rumors