Zhengye Technology has stated that they currently do not offer equipment for non-destructive internal inspection of stacked chip packaging. Their existing X-RAY detection equipment is primarily used for inspecting defects within lithium batteries, though they are exploring applications in new sectors like electronics manufacturing. Separately, Tianma Microelectronics has denied rumors about BOE potentially acquiring them. AI
RANK_REASON The cluster contains company statements about current product offerings and denials of rumors, not a new product release or significant industry event.
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