TSMC's C.C. Wei: CoPoS to scale up in two years at the earliest
TSMC Chairman C.C. Wei stated that the company's CoPoS advanced packaging technology is expected to reach significant production volumes within two to three years. This advancement follows their current CoWoS technology and aims to meet growing market demand for sophisticated chip packaging solutions. Separately, Liftoff Mobile, Inc. has priced its initial public offering at $23.00 per share, with an expected completion date in early June 2026. AI
IMPACT Accelerates the supply chain for advanced AI chips by enabling more sophisticated packaging solutions.