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中文(ZH) 台积电魏哲家：CoPoS最快两年放量

TSMC targets 2-3 years for CoPoS advanced packaging scale

By PulseAugur Editorial · [1 sources] ·

TSMC Chairman C.C. Wei stated that the company's CoPoS advanced packaging technology is expected to reach significant production volumes within two to three years. This advancement follows their current CoWoS technology and aims to meet growing market demand for sophisticated chip packaging solutions. Separately, Liftoff Mobile, Inc. has priced its initial public offering at $23.00 per share, with an expected completion date in early June 2026. AI

IMPACT Accelerates the supply chain for advanced AI chips by enabling more sophisticated packaging solutions.

RANK_REASON The cluster discusses a significant advancement in semiconductor manufacturing technology by a major industry player, TSMC, with a clear timeline for scaling production. [lever_c_demoted from significant: ic=1 ai=0.7]

Read on 36氪 (36Kr) →

AI-generated summary · Google Gemini · from 1 sources. How we write summaries →

TSMC targets 2-3 years for CoPoS advanced packaging scale

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The cluster discusses a significant advancement in semiconductor manufacturing technology by a major industry player, TSMC, with a clear timeline for scaling production. [lever_c_demoted from signi…
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COVERAGE [1]

  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    TSMC's C.C. Wei: CoPoS to scale up in two years at the earliest

    台积电董事长暨总裁魏哲家于股东会回应先进封装技术布局时指出，针对市场关注从CoWoS推进至CoPoS，台积电目前已建置CoPoS试产线，预估需要二至三年，产量才会达到相当大的规模。（界面）

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