华为已开发出一种新的122TB固态硬盘，用于数据中心和AI推理，规避了美国对先进3D NAND芯片的制裁。该公司采用专有的板上芯片（DoB）封装技术，将NAND芯片直接安装在PCB上，在不依赖外国受制裁技术的情况下提高了密度。这项创新使华为能够使用密度较低的中国制造的NAND芯片来实现高容量，可能促进中国半导体行业的更大独立性。 AI
影响 支持AI基础设施高密度存储解决方案的开发，可能减少对外国技术的依赖。
排序理由 一款采用新型技术规避地缘政治制裁的高容量固态硬盘产品发布。
AI 生成摘要 · Google Gemini · 来自 3 个来源。 我们如何撰写摘要 →
Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage dev…
Huawei develops 122TB SSD using proprietary chip packaging technology amid semiconductor restrictions.
Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese fir… Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count…