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English(EN) Modeling Liquid-Cooled Data Centers in EnergyPlus

新的 EnergyPlus 对象对液冷数据中心进行建模以应对 AI 工作负载

研究人员开发了一个新的 EnergyPlus 对象 ElectricEquipment:ITE:LiquidCooled,用于准确模拟数据中心中的直接芯片液冷系统。这一进展解决了现有工具在评估高密度人工智能基础设施的长期能源效率方面的局限性。新模型集成了液冷系统的各种组件,从设施水循环到芯片结温,并通过与独立的 Modelica 实现进行高精度验证。一项案例研究表明,与传统的风冷系统相比,温水液冷可显著降低电源使用效率 (PUE) 和整体设施能耗。 AI

影响 能够更准确地为人工智能驱动的数据中心基础设施建模能源效率。

排序理由 学术论文,详细介绍了一种用于数据中心基础设施的新建模方法。[lever_c_demoted from research: ic=1 ai=0.7]

在 arXiv cs.LG 阅读 →

AI 生成摘要 · Google Gemini · 来自 1 个来源。 我们如何撰写摘要 →

新的 EnergyPlus 对象对液冷数据中心进行建模以应对 AI 工作负载

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学术论文,详细介绍了一种用于数据中心基础设施的新建模方法。[lever_c_demoted from research: ic=1 ai=0.7]
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报道来源 [1]

  1. arXiv cs.LG TIER_1 English(EN) · Yun-Dam Ko, Dipashreya A. Sur, Cade Napier, Carlos D. D\'iaz-Mar\'in, Rishee K. Jain ·

    在EnergyPlus中模拟液冷数据中心

    arXiv:2610.33148v1 Announce Type: cross Abstract: As AI workloads accelerate data center transition toward high-density racks with direct-to-chip (DTC) liquid cooling, existing simulation tools remain limited in evaluating whole-building and multi-year efficiency. To bridge this …