三星正在开发定制的高带宽内存（HBM）解决方案，与标准HBM4相比，这些解决方案显著减小了物理占地面积并提高了效率。这些定制设计用紧凑的芯片到芯片链接取代了宽PHY接口，从而为计算芯片释放了宝贵的空间。这种优化对于Nvidia的Rubin等高性能GPU尤其重要，因为目前内存接口占用了计算芯片的很大一部分。 AI
影响 定制HBM解决方案可以通过提高计算芯片效率和带宽来加速AI硬件开发。
排序理由 该集群讨论了内存技术（HBM4）的进步及其对主要硬件产品（Nvidia GPU）的影响，表明这是一项重要的行业发展。
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And once the base die sits on an advanced logic process, it can do more than relay signals. Samsung points to SRAM repair resources, monitoring, connections to external memory, even selected computation under the DRAM become possible with a custom controller. To learn more about
Custom HBM tackles this issue head on. First, the wide standard PHY gets replaced with a compact die-to-die link. Samsung shows that its standard HBM4 PHY occupies 8mm x 4mm, while the custom D2D interface needs just 8.5mm x 1.5mm, roughly 60% less area. The better D2D interface …
Real estate on the compute die is extremely valuable, yet a surprising share of it is spent just interfacing with memory. We estimate that HBM4 controllers and PHYs take up roughly 16% of Nvidia's Rubin compute die. That is a lot of leading-edge silicon spent talking to memory ht…