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English(EN) ASML locks in TSMC, Samsung, and Intel while Huawei races to break its grip

ASML 为新款光刻掩模与主要芯片制造商达成协议;华为寻求独立

ASML Holding 已与主要芯片制造商台积电(TSMC)、三星(Samsung)和英特尔(Intel)达成协议,将采用更大的光刻掩模。此举预计将使 ASML 最新 EUV 光刻机的效率提高 40%。与此同时,华为正领导中国减少对 ASML 光刻技术的依赖,据报道正与设备制造商 Yuliangsheng 及其他国内供应商合作。 AI

影响 这一发展影响了先进半导体制造的供应链,这对 AI 硬件开发至关重要。

排序理由 ASML 就新技术与主要芯片制造商达成协议,而竞争对手(华为)则努力摆脱对该技术的依赖。[lever_c_demoted from significant: ic=1 ai=0.7]

在 The Decoder 阅读 →

AI 生成摘要 · Google Gemini · 来自 1 个来源。 我们如何撰写摘要 →

ASML 为新款光刻掩模与主要芯片制造商达成协议;华为寻求独立

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ASML 就新技术与主要芯片制造商达成协议,而竞争对手(华为)则努力摆脱对该技术的依赖。[lever_c_demoted from significant: ic=1 ai=0.7]
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High
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报道来源 [1]

  1. The Decoder TIER_1 English(EN) · Maximilian Schreiner ·

    ASML锁定台积电、三星和英特尔,而华为正努力打破其垄断

    <p><img alt="" class="attachment-full size-full wp-post-image" height="675" src="https://the-decoder.com/wp-content/uploads/2024/08/asml_highna_cleanroom_veldhoven_067.jpg" style="height: auto; margin-bottom: 10px;" width="1200" /></p> <p> ASML has won over Samsung, TSMC, and Int…