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English(EN) SK hynix breaks ground on the first HBM plant in the US, bringing key AI component production to the States — says production starts in 2029

SK Hynix在美国破土动工建设首个HBM工厂，将于2029年开始生产

作者 PulseAugur 编辑部 · [1 个来源] ·

SK Hynix已在美国印第安纳州破土动工建设首个高带宽内存（HBM）生产工厂。这家投资40亿美元的工厂将专注于HBM的先进封装、测试和研发，计划于2029年下半年开始生产。该工厂旨在为美国本土的AI公司提供在国内组装的HBM，从而降低供应链的复杂性并促进与普渡大学等学术机构的合作。 AI

影响 该工厂将加强国内AI组件供应链，并通过确保更贴近美国客户来可能加速AI发展。

排序理由 一家主要半导体制造商在美国建设首个HBM生产工厂的破土动工。 [lever_c_demoted from significant: ic=1 ai=0.7]

在 Tom's Hardware 阅读 →

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SK Hynix在美国破土动工建设首个HBM工厂，将于2029年开始生产

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一家主要半导体制造商在美国建设首个HBM生产工厂的破土动工。 [lever_c_demoted from significant: ic=1 ai=0.7]
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报道来源 [1]

  1. Tom's Hardware TIER_1 English(EN) · Anton Shilov ·

    SK hynix 在美国破土动工建设首个 HBM 工厂，将关键 AI 组件生产带到美国——称将于 2029 年开始生产

    SK hynix breaks ground on HBM assembly plant in the U.S. that will form a connection between DRAM wafers produced in South Korea and their consumers among AI companies in the U.S.

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