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English(EN) Hot Chips 2026: d-Matrix stacks AI accelerator directly on custom DRAM for 100 TB/s per card — TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed die

d-Matrix 发布具有 100 TB/s 带宽的 3D DRAM AI 加速器

作者 PulseAugur 编辑部 · [1 个来源] ·

d-Matrix 发布了其 Raptor AI 加速器，该加速器采用了新颖的 3D 堆叠架构。该设计将 TSMC 4nm 计算芯片直接堆叠在定制设计的 DRAM 芯片之上，实现了每张卡前所未有的 100 TB/s 带宽。该公司声称，与传统的基于 HBM 的设计相比，这种方法显著降低了数据传输的能耗，并预计在生成式推理任务中实现更高的吞吐量。 AI

影响 这种新颖的 3D 堆叠方法可以显著提高 AI 推理的性能和效率，有可能降低成本并实现更强大的设备端 AI。

排序理由 AI 加速器的新硬件架构，具有显著的性能声明。[lever_c_demoted from significant: ic=1 ai=0.7]

在 Tom's Hardware 阅读 →

AI 生成摘要 · Google Gemini · 来自 1 个来源。 我们如何撰写摘要 →

d-Matrix 发布具有 100 TB/s 带宽的 3D DRAM AI 加速器

本文如何被排名

Signal score
47 / 100
Composite score across the factors below. Higher = stronger signal that this story matters right now.
Newsworthiness bucket
Research
AI 加速器的新硬件架构，具有显著的性能声明。[lever_c_demoted from significant: ic=1 ai=0.7]
Source corroboration
Single-source cluster
Only one publisher covered this so far. Single-source stories can still rank when the publisher is high-authority, but they lack cross-source corroboration.
Topics
infra, model release
Editorial topic classification. Feeds into how the story surfaces on /topic/<slug> hub pages and into the per-entity coverage mix.
AI-industry relevance
High
Clearly on-topic for AI-industry coverage.
Story freshness
Breaking (< 6h)
Fresh story with cross-source coverage still developing. Ranking may shift as more sources report.

完整方法见我们的编辑标准。

报道来源 [1]

  1. Tom's Hardware TIER_1 English(EN) · Luke James ·

    Hot Chips 2026：d-Matrix 将 AI 加速器直接堆叠在定制 DRAM 之上，每卡速度达 100 TB/s — TSMC 4nm 计算芯片以 36 微米间距与定制设计芯片正面粘合

    d-Matrix presented Raptor, which it calls the first 3D DRAM accelerator for generative inference, showing a TSMC 4nm compute die bonded face-to-face at a 36-micron pitch on top of a custom-designed DRAM die.

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