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ENTITY JEDEC

JEDEC

PulseAugur coverage of JEDEC — every cluster mentioning JEDEC across labs, papers, and developer communities, ranked by signal.

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  1. 2026-07-08 research_milestone JEDEC released the new SPHBM4 standard to lower the cost of AI memory. source
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RECENT · PAGE 1/1 · 7 TOTAL
  1. TOOL · CL_181241 ·

    MCP, eMMC, and eMCP: Understanding Integrated Memory Technologies

    This article delves into the distinctions between Multi-Chip Package (MCP), embedded MultiMediaCard (eMMC), and embedded Multi-Chip Package (eMCP) technologies. MCP is a packaging method that integrates multiple chips l…
  2. RESEARCH · CL_132410 ·

    JEDEC's SPHBM4 Standard Slashes AI Memory Costs

    JEDEC has introduced a new standard, SPHBM4, designed to reduce the cost of High Bandwidth Memory (HBM) used in AI processors. This standard utilizes a narrower 512-bit interface and allows for the use of less expensive…
  3. SIGNIFICANT · CL_124047 ·

    New SPHBM4 standard aims to democratize HBM for AI chips

    JEDEC has announced a new standard, SPHBM4 (JESD330-4), designed to democratize High Bandwidth Memory (HBM) by enabling its use in standard packaging. This new standard allows for HBM assembly outside of specialized, su…
  4. RESEARCH · CL_109406 ·

    SNIA launches MRAM SIG to standardize interfaces and boost adoption

    The Storage Networking Industry Association (SNIA) has launched a Magnetoresistive Random-Access Memory (MRAM) Special Interest Group (SIG) to foster MRAM adoption. This group aims to standardize MRAM technologies and d…
  5. RESEARCH · CL_92013 ·

    JEDEC develops LPDDR6 for AI's growing on-device demands

    JEDEC is developing LPDDR6 memory to meet the increasing demands of on-device AI applications. This new memory standard aims to provide higher bandwidth and lower power consumption, crucial for accelerating AI tasks dir…
  6. SIGNIFICANT · CL_63493 ·

    AMD launches EXPO Ultra Low Latency DDR5 memory

    AMD has introduced EXPO Ultra Low Latency (ULL) for DDR5 memory, aiming to enhance performance by optimizing sub-timings. The company claims this new feature will offer a 4% average performance uplift over standard EXPO…
  7. RESEARCH · CL_19066 ·

    Memory giants push new MRDIMM standard for AI, HPC servers

    Major memory manufacturers Samsung Electronics, SK Hynix, and Micron are nearing completion of the next-generation server DRAM module standard, MRDIMM. This new standard is optimized for AI and high-performance computin…