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SIGNIFICANT · CL_232444 · Sep 2 · 15:05

Hybrid Bonding for HBM Delayed to Decade's End, Logic Adoption Advances

Hybrid bonding, a copper-to-copper chip joining technique, is in high-volume production for logic chips but its adoption for High Bandwidth Memory (HBM) has been delayed. A recent JEDEC decision allows HBM4 to continue …