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中文(ZH) 银河证券:AI算力建设需求爆发推动存储长周期涨价,HBM投片比重将持续提升

AI compute demand to drive HBM prices and production share higher

Galaxy Securities predicts that the surge in AI computing power construction will lead to a prolonged increase in memory prices, with High Bandwidth Memory (HBM) production share expected to rise significantly. NVIDIA's upcoming Rubin Ultra platform will increase HBM capacity per GPU to 384GB, further boosting demand alongside growing AI ASIC shipments. TrendForce forecasts HBM's share of total DRAM production to grow from 18% in 2025 to approximately 30% by 2027, with its bit supply share increasing from 8% to about 13%. The report also highlights 3D stacked DRAM as a key technology for overcoming traditional memory bottlenecks driven by the growth of edge AI. AI

IMPACT Increased demand for HBM and 3D stacked DRAM will likely drive innovation and potentially higher costs in AI hardware components.

RANK_REASON The item is an analysis from Galaxy Securities about market trends in AI hardware, not a direct release from a frontier lab or a major industry event.

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  1. 36氪 (36Kr) TIER_1 中文(ZH) ·

    Galaxy Securities: AI computing power construction demand surge drives long-term price increase for storage, HBM shipment ratio will continue to rise

    36氪获悉,银河证券发布电子行业2026年中期策略称,AI算力建设需求爆发推动存储长周期涨价,HBM投片比重将持续提升。随着NVIDIA新一代Rubin Ultra平台即将推出,单颗GPU配置HBM容量将进一步提升至384GB,加上AI ASIC出货量持续增加,将带动HBM需求再度跃升。TrendForce预估,HBM投片量占整体DRAM投片比重将由2025年的18%提升至2027年约30%;HBM位元供给占比也将由8%提高至约13%。此外,随着端侧AI技术的爆发式增长,3D堆叠DRAM方案正成为突破传统存储瓶颈的关键技术路径。