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Huawei launches 122TB SSD using novel packaging to bypass US chip sanctions

By PulseAugur Editorial · [3 sources] ·

Huawei has developed a new 122TB SSD for data centers and AI inference, circumventing US sanctions on advanced 3D NAND chips. The company utilizes a proprietary Die-on-Board (DoB) packaging technique, which mounts NAND dies directly onto the PCB, increasing density without relying on foreign, sanctioned technology. This innovation allows Huawei to use less dense Chinese-made NAND chips to achieve high capacities, potentially fostering greater independence in China's semiconductor industry. AI

IMPACT Enables development of high-density storage solutions for AI infrastructure, potentially reducing reliance on foreign technology.

RANK_REASON Product launch of a high-capacity SSD using novel technology to circumvent geopolitical sanctions.

Read on Pandaily →

AI-generated summary · Google Gemini · from 3 sources. How we write summaries →

Huawei launches 122TB SSD using novel packaging to bypass US chip sanctions

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0 / 100
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Newsworthiness bucket
Significant
Product launch of a high-capacity SSD using novel technology to circumvent geopolitical sanctions.
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3 independent sources
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Topics
product, policy, infra
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High
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103 days old
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+1 source(s) since last score
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COVERAGE [3]

  1. Tom's Hardware TIER_1 English(EN) · Jowi Morales ·

    Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

    Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage dev…

  2. Pandaily TIER_1 English(EN) · [email protected] (Pandaily) ·

    Huawei Produces 122TB SSD Using Proprietary Chip Packaging Technology

    Huawei develops 122TB SSD using proprietary chip packaging technology amid semiconductor restrictions.

  3. Mastodon — fosstodon.org TIER_1 English(EN) · [email protected] ·

    Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese fir… Huawei developed a new die-on-board packaging, which

    Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese fir… Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count…

    LINKS tomshardware.com/…/huawei-introduces-122t… tomshardware.com/pc-components

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