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ENTITY Die-on-Board (DoB) packaging

Die-on-Board (DoB) packaging

PulseAugur coverage of Die-on-Board (DoB) packaging — every cluster mentioning Die-on-Board (DoB) packaging across labs, papers, and developer communities, ranked by signal.

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  1. SIGNIFICANT · CL_43376 ·

    Huawei launches 122TB SSD using novel packaging to bypass US chip sanctions

    Huawei has developed a new 122TB SSD for data centers and AI inference, circumventing US sanctions on advanced 3D NAND chips. The company utilizes a proprietary Die-on-Board (DoB) packaging technique, which mounts NAND …